Chapter 13 -Processes

for Electronic Products

Group 14
Georgie Vinuya
Lizette Papa
D. Cleaning after soldering

Cleaning printed circuit boards is

carried out to remove leftover flux,
dust, and various other minor soils
D1. Solvent Cleaning
Cleansing process that uses chemical solutions
to remove unwanted grease, oil, coatings or
paint from the surface of a material
D2. Water Washing
Water without additives

Water with surfactants

Water with saponified


These are a number of water based cleaning

methods that may be used individually or in
sequence
D3. Semi-aqueous cleaning
Uses solvents that do not have the
disadvantage of a significant ozone-depletion
property, or other serious environmental
drawbacks.
Two stages in semi-aqueous cleaning process

First stage Second Stage

Involves washing the Is a water wash that removes
workpiece with the traces of the solvent, a
organic solvent (terpene surfactant added to the water.
or alcohol).
E. Making Solder Paste

Solder paste is a homogeneous,

stable mixture of flux, pre-alloyed
solder powder and other ingredients
into a single material.
E1. Making solder powder
by gas atomization
Is the major manufacturing method
for solder powder used in solder
paste
E2. Spinning disk powder making
In this method, molten solder
flowing through an orifice into a
spinning disk or cup, is flung
outward by cylindrical force, to
form fine droplets
E3. Ultrasonic method of powder making
In this method, the molten solder is directed to
flow against an ultrasonic horn, a metal device
vibrating at a frequency above that of audible
sound.
E4. Screen classification of
powder
With a vertical gas atomization
chamber, the powder settles to
the bottom of the chamber
E5. Air classification of powder

Is less precise as a classification method

for particles above 35µm but is very
discriminating for particles less than
20µm
E6. Inspection of Powder
The simplest method for
checking solder powders
used in solder paste is to
spread a thin layer of the
powder on a glass slide and
then examine this layer
with a microscope.
E7. Mixing solder paste
Is a batch operation where solder
powder, flux, plasticizers, tackifiers,
thickeners, or thinners are blended in
mixers designed for the high density
and high viscosity of the paste
E8. Inspection of paste
A number of tests can be made on
the solder paste to verify its
properties
Test used in inspecting solder paste

 Tackiness testing
 Slump tests
 Performance tests
F. Ball Grid Arrays
 Utilize spheres of solder to provide
the necessary material to
electrically connect large integrated
circuits to printed circuit boards.
G. Fluxes for Electronics

Fluxes perform the same functions

with respect to the joint surfaces of
printed circuit boards as they do
when used for mechanical and
other soldering
H. Tinning
Leads, contacts, traces, pads, and other
solder joint areas are coated – tinned –
with a solder alloy prior to the
soldering, lessen the need for strong
fluxes that may attack the circuit
board, and provide longer storage life.
I. Quality Control and Inspection
Operations

I1. Visual inspection of joints

Is a manual inspection for the following characteristics

I2. Incoming Inspection

Of materials and boards before soldering connections

I3. Solderability Testing

Is performed by dip soldering the joint area, after proper
fluxing, of the component to be tested
J. Repair and Touch-up
Soldering operations involving circuit
boards do not have a 100% yield, so
there is always some need to repair or
touch-up solder joints after the main
soldering operation.
THANK YOU