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Chapter 1 Introduction To VLSI Testing
Chapter 1 Introduction To VLSI Testing
Chapter 1 Introduction
to VLSI Testing
超大型積體電路測試簡介
趙家佐
Goal of this Lecture
2
Introduction to IC Testing
Introduction
Types of IC testing
Manufacturing tests
Test quality and economy
Test industry
3
IC (SOC) Design/manufacture
Process
Specification
Architecture
Architecture Design
Design
Chip
Chip Design Chip design phase
Test
Test
•Logic synthesis
Chip
Chip Design
Design
•Timing verification
•Placement, route and layout
•Physical synthesis
Fabrication •Test development and plan
6
Test Challenges
Test time exploded for exhaustive testing
For a combinational circuit with 50 inputs, we need
250 = 1.126x1015 patterns = 1.125x108s = 3.57yrs.
(10-7s/pattern)
Combinational circuit = circuit without memory
Too
Too many
many input
input pins too
pins too many
many input
input patterns
patterns
7
More Challenges
High automatic test equipment (ATE) cost
for functional tests
Testing circuits with high clock rates
Deep sub-micron/nano effects
Crosstalk, power, leakage, lithography, high
vth variation…
Test power > design power
Integration of analog/digital/memories
SOC complexities
8
Testing Cost
Test equipment cost
Analog/digital signal and measuring instrumentation
Test head
Test controller (computer & storage)
Test development cost
Test planning, test program development and
debug
Testing-time cost
Time using the equipment to support testing
Test personnel cost
Training/working
Testing Cost in Y2k
Testing of complex IC is responsible for the
second highest contribution to the total
manufacturing cost (after wafer fabrication)
0.5-1.0GHz, analog instruments, 1024 digital
pins: ATE purchase price
$1.2M + 1024*$3000 = $4.272M
Running cost (5-yr linear depreciation)
= Depreciation + Maintenance + Operation
= $0.854M + $0.085M + $0.5M
= $1.439M/yr
Types of IC Testing (I): Audition of
System Specification
Fabrication
Test
11
Types of IC Testing (II):
Verification
Specification
Test
13
Types of IC Testing (IV):
Production Testing
Specification
In production, all fabricated parts are
subjected to production testing to detect
Architecture Design
process defects.
To enforce quality requirements
Chip Design Applied to every fabricated part
14
Types of IC Testing (V):
Diagnosis
Specification
Failure mode analysis (FMA) is applied
to failed parts.
Architecture Design
To locate the cause of misbehavior after
the incorrect behavior is detected.
Chip Design
Results can be used to improve the
design or the manufacturing process.
Fabrication
An important step for improving chip
Test
production yield.
15
Multiple Design Cycles
Specification
Chip Design
Fabrication
Long
Long iterations Late
iterations Late time-to-market/production
time-to-market/production
16
A Broad View of Chip Design
and Production Phases
Characterization
Design
Design FAB
FAB Debug
Debug
Re-design
Re-design FAB
FAB Production test
Diagnosis
Time to Market
Time to Yield
17
What Are We After in Testing?
Inconsistent specification
Manufacturing defects
Process faults/variation
Time-dependent failures (reliability)
Packaging failures
18
Various Design Errors
24
Tests Before and After
Production
(Before) Characterization Testing
For design debug and verification
limits
Comprehensive functional, DC and AC parametric tests
25
Test Items for Production Testing
28
DC Parametric Tests
29
AC Parametric Tests
30
Burn-in Tests
~ 20 weeks 5 – 25 yrs
Time
10,000
No burn-in
1,000
125C burn-in
100
10
150C burn-in
1
101 102 103 104 105 106
Time (hr)
32
Functional Tests
Test
result
33
Activities for Developing
Functional Tests
Specification
Test
Apply test patterns
34
Key Issues of Functional Tests
35
Functional v.s. Structural Test
Functional test
Exercise the functions according to the spec
Often require designers’ inputs
Large number of patterns with low fault coverage
Difficult to be optimized for production tests
Structural test
Use the information of interconnected components
(e.g., gates) to derived test regardless of the functions
Fault modeling is the key
Basis of current testing framework---ATPG, Fault
simulator, DFT tools, etc.
36
Fault Models
Fault modeling is a way to represent the
cause of circuit failure.
Model the effects of physical defects by the
logic function and timing
Enumeration of real defects is impossible
Makes effectiveness measurable by
experiments
Fault coverage can be computed for specific
test patterns to reflect its effectiveness
37
Single Stuck-At Fault Model
Assumptions:
Only One line is faulty
Faulty line permanently set to 0 or 1
Fault can be at an input or output of a gate
A B G A B G
0 0 0 0 0 0
0 1 1 0 1 0
1 0 1 1 0 0
1 1 1 1 1 1
Only binary values, 0 and 1, will be used.
A and B are inputs and G is the output. 39
Stuck-At Faults Example
Stuck-at 1 Stuck-at 0
A E
B
G
C F
D
A=0 E=0
B=1
G=1
C=1 F=1
D=1
41
What if F stuck-at-0 occurs
with (ABCD)=(0111)
A=0 E=0
B=1
G=10
C=1 F=10
D=1
A=0 E=0
B=1
G=1
C=1 F=1
D=1
A=0 E=0
B=1
G=1
C=1 F=1
D=1
A=0 E=0
B=1
G=0
C=0 F=0
D=1
A=0 E=0
B=1
G=0
C=0 F=0
D=1
Fault Coverage T
Is the measure of the ability of a set of tests to
detect a given class of faults that may occur on
the device under test (DUT)
49
An Example of ATPG for E
stuck-at-0
Step 2:
assign A=1 and B=1 Step 1: assign E=1
A E/0
Finally, we will see
B G=1 for fault-free circuits, and
G=0 for faulty circuits.
C F
D Step 3: assign F=0
Step 4:
assign (C, D)=(0, 0), (0, 1), or (1, 0)
Oh no!
What does
Simulation functionally correct! this chip do?!
We're done!
Design Engineer
Test Engineer
51
Design for Testability (DFT)
52
Full Scanned Sequential Logic
---An Example of DfT
Scan_Ena
Scan
Test for SA0 fault here. Flip-Flop
Scan_In
53
Multiple Design Missions
Chips have to optimally satisfy many constraints:
area, performance, testability, power, reliability, etc.
Performance
Area
Power Testability
54
Definition of BIST
Test
ATE
BIST
56
Testing and Quality
Shipped Parts
ASIC
Yield: Testing
Fabrication Quality:
Fraction of Defective parts
Good parts Per Million (DPM)
Rejects
57
Defect Level
Defect Level
Is
the fraction of the shipped parts that
are defective
DL = 1 – Y(1-T)
Y: yield
T: fault coverage
58
Defect Level v.s. Fault
Coverage
Defect Level
1.0 Y = 0.01
Y = 0.1
0.8
Y = 0.25
0.6
Y = 0.5
0.4
Y = 0.75
0.2 Y = 0.9
0 20 40 60 80 100
59
DPM v.s. Yield and Coverage
Test time
Time using the equipment to support testing
Test personnel
61
Components of Test Costs (II)
Time to Market
Product quality
Impact a company’s image and sales
62
Cost Of Testing - The Rule of
Tens
1000
Cost
Per 100
Fault
(Dollars)
10 500
50
1 5.0
0.5
63
Implications of Rule of Tens
64
Test Economics
Build an appropriate
$
Non-recurring costs
Specification
cost/benefits model based on
empirical data of the
manufacturing process. $ Architecture Design
Evaluate test strategies (DFT;
BIST) according to the model
$ Chip/test Design
Customize the model for each
project
Follow and review the model $ Fabrication
closely through careful
management
Test
$ Test
66
Conclusions
67