EEE 6410

Semiconductor Characterization Technology

Course Teacher:
Professor Md. Shafiqul Islam, PhD
Room #: EE 327
Dept. of EEE, B.U.E.T., Dhaka-1000.
web: http://islams.buet.ac.bd
Email: islams@eee.buet.ac.bd
Tel.: 01815007759 (cell)
 Syllabus
• EEE 6410: Semiconductor Characterization Technology
Introduction to Thin Film Technology: overview of various growth and
deposition techniques.
• Electrical characterization: resistivity measurements, Hall measurement,
current-voltage (I-V), capacitance-voltage (C-V), deep level transient
spectroscopy (DLTS), lifetime measurements etc.
• Structural characterization: X-ray diffraction (XRD), Low energy electron
diffraction (LEED), reflection high energy electron diffraction (RHEED),
atomic force microscopy (AFM), scanning tunneling microscopy (STM),
scanning electron microscopy (SEM), transmission electron microscopy
(TEM), Rutherford backscattering spectroscopy (RBS), Energy dispersive x-
ray analysis (EDX), Auger electron spectroscopy (AES), Electron energy loss
spectroscopy (EELS), secondary ion mass spectroscopy (SIMS), X-ray
photoelectron spectroscopy (XPS), elastic recoil detection (ERD).
• Optical characterization: optical transmittance and reflectance spectroscopy,
ellipsometry, photoluminescence (PL), Raman spectroscopy, Fourier
transform infrared spectroscopy.
 THIN FILM CHARACTERIZATION TECHNIQUES

OPTICAL* TECHNIQUES ION BEAM TECHNIQUES ELECTRON MICROSCOPY

Diffraction  Rutherford backscattering  Low energy electron diffraction (LEED)

 X-ray diffraction (XRD) spectrometry (RBS)  Reflection high energy electron
Reflection/Transmission  Elastic recoil detection (ERD) diffraction (RHEED)
 Optical microscopy  Ion induced x-ray spectroscopy (IIX)  Scanning electron microscopy (SEM)
 Ellipsometry  Nuclear reaction analysis (NRA)  Transmission electron microscopy
Absorption/Emission  Channeling (TEM)
 Photoluminescence  Secondary ion mass spectrometry
 Photoconductivity (SIMS)
 Fourier transform infrared spectroscopy
(FTIR)
 Raman spectroscopy
 Ultraviolet photoelectron spectroscopy
(UPS)
 X-ray photoelectron spectroscopy (XPS)
ELECTRICAL SCANNING PROBE ANALYTICAL ELECTRON
TECHNIQUES MICROSCOPY MICROSCOPY
 Resistivity & Hall effect  Scanning tunneling microscopy  Auger electron spectroscopy (AES)
 Capacitance-voltage (C-V) (STM)  Energy dispersive x-ray analysis (EDX)
 Deep level transient spectroscopy  Atomic force microscopy (AFM)  Electron energy loss spectroscopy
(DLTS) (EELS)
 Langmuir probe
OTHER TECHNIQUES
 Positron annihilation spectroscopy (PAS)
 Electron paramagnetic resonance (EPR)
 Contact angle measurements
* Optical techniques refers to all regions of the electromagnetic spectrum from IR to X-rays
 Text and Reference Books
• M. Ohring, “The Materials Science of Thin Films” (Academic
Press; 2nd edition (October 15, 2001), ISBN-10:
0125249756).
• D. K. Schroder, “Semiconductor Material and Device
Characterization” (Wiley-IEEE Press; 3 edition (January 30,
2006), ISBN-10: 0471739065).
• Peter Van Zent, “Microchip Fabrication”, McGraw-Hill, 5th Ed.,
May 19, 2004 (www.digitalengineeringlibrary.com).
• R. C. Jaeger, “Introduction to Microelectronic Fabrication”,
Volume 5 of Modular Series on Solid State Devices (2nd
Edition) (Addison-Wesley Publishing Company, 2001).
• H. Bubert and H. Jennet “Surface and Thin Film Analysis,” pdf
copy available.