Design For Manufacturability Seminar

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Design For

Manufacturability ( DFM)

C.Devanathan,
200821522,
CIM II Year.
Design for Manufacturability 1
Contents
 Introduction and Definition
 History of DFM
 DFM Principle
 Why DFM
 Objectives of DFM
 DFM activities
 DFM typical approach
 DFM Tools and methodology
 DFM in Electronics Industry
 Case study
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Introduction
 DFM is product design considering
manufacturing requirements
 DFM is the first step in which a team
approach is taken to develop the
product.
 DFM is an umbrella which covers a
variety of tools and techniques to
accomplish a manufacturable product.

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Introduction
 Design for manufacturability is the
process of proactively designing
products to
(1) Optimize all the manufacturing
functions: fabrication, assembly, test,
procurement, shipping, delivery, service,
and repair.
2) Assure the best cost, quality,
reliability, regulatory compliance, safety,
time-to-market, and customer
satisfaction.

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Definition
 Design for Manufacturing (DFM) is a
development practice emphasizing
manufacturing issues throughout the
product development process.
 Successful DFM results in lower
production cost without sacrificing
product quality.

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History of DFM
 Principles of DFM are not new.
– Awareness of importance of designing
parts for easy manufacturing is key for
all time.
– Difference is in the use of standards
and design guides during the
beginning stages of the design and
not later

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Eli Whitney (early 1800’s)
 Made use of standardizing the design of
the lock on the musket so that
interchangeable parts could be used
 Before him, all muskets were made by
craftsmen and no two muskets were the
same or used the same parts.
 His parts were built to specs and a
tolerances
 He organized a mass production process
for locks
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History Contd.,
 Book edited by Richard Bolz who
organized the DFM methodology
 DFM was originally called
producibility (1960’s) and then
manufacturability (1970’s) and then
Design for Manufacturability (1985)

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DFM Principles
 Use of standards
Use of common components
Design to specifications and
tolerances
Use of manufacturing guidelines in
the early stages of design that
maximize quality of manufactured
part

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DFM Principles
 Minimize the use of materials
Minimize the use of floor space in
plant
Locate all necessary components
near functional operation
Use of automated machining for
minimal errors

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Why DFM?
 60% of overall product cost is
determined by decisions made early in
the design process
75% of manufacturing cost is
determined by design drawings and
specifications
70 – 80% of all products’ defects are
directly related to design issues

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Why DFM?
Lower development cost
Shorter development time
Faster manufacturing start of
build
Lower assembly and test costs
Higher quality

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Objective of DFM
 To identify product concepts that are
easy to manufacture
 Focus on component design for ease of
manufacture and assembly
 Integrate manufacturing to ensure the
best match of needs and requirements.

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Activities of DFM
 An analysis of the complete
product in order to simplify its
design.
 An analysis of each individual part
to maximize its manufacturability.

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DFM Typical Approach
Product Development team making it happen!!
 - Product requirements and deliverables
- DFM tools and methods

start
finish

Design
Test Tool Build
Launch

Product Development Steps


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DFM Typical Approach
 Product Team
– EE
– Project Manage
– Component Engineer
– Purchasing
– Fab., process engineer
– Assembly process engineer
– Test engineer
– Quality engineer
– Uses DFM tools and methods

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For a Sound DFM Team:
Training / Education of several types
are needed:
 Attitudinal training.
 Clear role clarification.
 Information – sharing.
 Involvement and participation

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DFM Tools and Methodology
 Use of the Standard Guidelines.
Design For Assembly (DFA), (IBM
experience)
Failure Mode and Effect Analysis
(FMEA), (Sun example)
Taguchi Method, (Hitachi
experience)

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DFM Tools and Methodology
 Value Analysis--”Value
Engineering” (HP example)
Quality Function Deployment
(QFD), Going to the Gemba
(Hitachi)
Group Technology, (IBM example)
Cost management and
optimization, SPC, Six-Sigma
(Motorola), TQC, etc
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DFM Tools Pro’s and Con’s
Technique Advantage Disadvantage

Guidelines  Cost and Effort  Exceptions to list


 Management
Team Approach
Taguchi  Systematic  Management
 Narrows  “Buy-in”
possibilities  Designer Effort
FMEA  Systematic  Management
 Priortizte corrective  Rates only ease of
action assembly
 Provides guidance

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DFM Tools: Comparisons
DFM ACTIVITY

DFM TOOLS PRODUCT SIMPLIFY PROCESS FUNCTIONAL


CONCEPT CONCEPT NEEDS NEEDS

DESIGN GUIDELINES X X
DESIGN FOR ASSEMBLY X
TAGUCHI X X
CUMPUTER AIDED DFM X X X X
GROUP TECHNOLOGY X X
FMEA X X
VALUE ANALYSIS X

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DFM in Electronics Industry

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Consideration and requirements of
Electronics Components
 Size, form, fit, function
Cost and availability
Initial quality and long term
reliability
Moisture sensitive device (MSD)
considerations and requirements
Solderability and solder joint
requirements

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Consideration and requirements of
Electronics Components
Component to board edge spacing
requirements
Component body to body spacing
requirements
Component to board CTE
requirements
All IC (PGA, BGA, DIP, SIP, SIMM,
DIMM, etc.) pins correctly identified

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circuit requirements
 DC
 Noise, cross talk, interference
 Micro strip
 Buried Micro strip
 Analog
 R/F
 EMI
 Shielding type
 Impedance
 High power
 Thermal
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PCB material considerations as
required
Impedance
Dielectric constant
Overall board construction
requirements
Dielectric withstanding voltage
Moisture and insulation resistance
Dielectric breakdown voltage
High power requirements
R/F and EMI requirements
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Guidelines for DFM in Electronics
Industry
 More important guidelines for
designers of Electronics products:
1. Standardization: Standardize
circuit board sizes and
dimensions.
2. Utilize the standard components
3. Standardize the orientation of the
devices on the board.
4. Product simplification

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Guidelines for DFM
5. The number of different hole sizes
on the printed board – minimized.
6. The location of identification labels
on components – standardized.
7. Minimize / eliminate the
adjustments
8. It is advisable to use only one
component placement method.

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Guidelines for DFM
9. Provide sufficient spacing between
leads, vias, and traces – to avoid
solder short circuit.
10.Componets that require a press to
install- avoided.
11. When flexible circuit boards are
used, avoid bends that are sharp so
as not to crack copper conduction
paths.
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Guidelines for DFM
12. Consider the environment in
which the product will be
manufactured and used.
13. Designers should be aware of the
stack-up of positional tolerances.
14.SMT boards require proper size
and spacing of mounting pads.

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Guidelines for DFM
15.Via holes should not be placed
under metal conditions.
16.For, through hole boards, most
traces should be on the component
side, fewest on the solder side.
17.Use of even number of circuit
board layers to reduce the
possibility of the circuit board
warping when the heat for
soldering is applied.
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Case Study in Electronics
industry

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Beyond Prototypes!! : Design for
Manufacturing Concerns for Pico Radio
Test bed
 Must add draft angle and fillets to
part. This will add complexity to
the model and slightly increase the
size of the part. Part will be
slightly conical instead of perfectly
cylindrical to allow part removal
from the injection mold.

 Currently two sliders are required


to form the serial port access hole
and the power switch hole. Both
holes need to be designed out.

 We will need to use larger screw


bosses to account for draft angle -
PCB cut-outs (hopefully) have
been enlarged to account for this.

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Beyond Prototypes!! : Design for
Manufacturing Concerns for Pico Radio
Test bed
 Add a feature to screw the
PCB directly to the
casing??

 Case lid should be stiffer.

 Casing design is small


enough to be shot on our
in-house injection press.

 EDM will be required to


make this mold. We must
located an external vendor
for this.

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Our MCAD tools
AutoCAD, Solidworks
SDRC’s IDEAS, OpenCascade

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Our ECAD tools
 Cadence’s ORCAD
– Will be used for Bluetooth radio boards,
schematics and PCB designs
– (Old BWRC CAD tools were Zuken Redac for
Layout, Routing, Manufacturing and
Viewlogic for the schematics)3

 Checking that these new tools can


export and import new standards from
the ISO

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DfM Pipelines (right side of ASU/UCB chart)

{
AP 210 Moldable Part
U
ECAD C MCAD Mold Fill
AP 203
A Mold
210

D Cut-ability
AP

E AP 203
Feature Manager
MOSIS
chip fab/pack.

Cybercut Pipeline

PCB Assembly Cut Mold


(Outsource) (Out source/In-House)

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STEP
The Standard for the Exchange of
Product model (STEP) Provides a
common method of defining product
data
Application Protocols (APs) define the
content, scope and information
requirements of a designated
application area

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STEP protocols AP203 and AP210

All mechanical CAD systems export


and import STEP files in the AP203
protocol
Electronic assembly interconnect
and packaging design is now
described in AP210

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STEP AP210
 April 1999
– ISO (International Organization for
Standardization) accepted STEP
Application Protocol as International
Standard
• Electronic Assemblies, Interconnection
and Packaging
• Printed Wiring Assemblies (PWA)

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Some Industries Following DFM
 AT&T  Toyota
 Boeing  Yahoo
 Lockheed Martin  Microsoft
 GE  IBM
 Intel  Cisco Systems
 GM  HP
 Ford  Sonic

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References
 Design for Manufacturability
Hand book - James G.Bralla.
 www.toodoc.com

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