Dlean Generic Items: Accelerating Results

accelerating results.
Helping Cisco close the gap between customer expectations
and time to market.
DLEAN GENERIC ITEMS DLEAN

Design for Lean (Eliminate, Simplify, Automate)
Generic items checklist
1 Labels
1 1.1 JPE propose to use Laser Barcode Engraving on Cisco PCBA
2 1.2 5in1 / 6in1 Label paste at Top/nearest to operator side - easy to access and scan at Test slot
3 1.3 JPE propose to consolidate individual labels onto 5 in 1
4 1.4 JPE propose to have scan able Barcode (different favor) is require for overlay, agency label, PID label and etc.
JPE propose to have SN # and Assembly # label on PCBA to be on a visible / accessible location for scanning close to
5 1.5 front faceplate
6 1.6 JPE propose to use 2 in 1 (73 + SN) label to save cost and area of pasting label
7 1.7 All dimm cards need to have scan able barcoded CPN label and facing up after installed
8 1.8 JPE propose to have different overlay color and font for similar look product.
9 1.9 JPE propose to have standardization product family label information.
10 1.10 JPE propose to standardized the 4 in 1, 5 in 1 & 6 in 1 raw label CPN.
Mechanical Part require Part Number with barcode LABEL paste on part’s visible area. LABEL must include inside
11 1.11
part’s drawing.
2 PCBA Design
12 2.1 JPE propose to remove all unused components (ex Headers, Mictor conn, RFID etc) before or during -A0 release
13 2.2 JPE propose to avoid chip components mounting in between tall components.
JPE observed Battery Holder lifted pad issue and propose to have battery holder with additional Ground pad at
14 2.3 centre for solid bonding with PCB. Battery and Battery holder should be separate Part #.battery holder might need to
be customize for Cisco product
15 2.4 JPE propose to eliminate wave process - Migration of Wave soldering process to SMT and press fit or Paste in Hole
concept.
16 2.5 JPE propose to move all router tabs/Mouse bites away from components/connectors
Eliminate ChemMask process for BTB (change nexlev to others type of component i.e infinix or Hirose) or no BTB
17 2.6
connectors at bottom side
18 2.7 JPE concern on raw Component orientation packaging and pitch to be standardize among all AVL
19 2.8 JPE concern that all component especially inductor should have a same terminal size among all AVL supplier
20 2.9 JPE prefer to have a standing (90deg) Dimm card installation.
3 Manual Assembly
21 3.1 JPE propose same physical outlook connector with minor resistance differences - need to standardize on same board
4 Mechanical Assembly
JPE propose to use same CPN for E-usb or Dimm card in same board / family. This is to avoid wrong E-usb/Dimm
22 4.1
installed side by side.
23 4.2 JPE propose that design for Ejector should not have direct contact/touching face plate to prevent scratches or mark.
24 4.3 JPE concern rubbing effect of ejector lever
JPE concern of Ejector handle rubber easily drop off, Handle Loose and Faceplate overlay easily cause dent/scratches
25 4.4
or gouge.
JPE propose to have enough clearance for wire insertion
26 4.5 Insulator easy to torn during cable tie assembly
Alternate better design possible ?
JPE prefer to use Heatsink type with Screw or TIM pad design - easy to assembly and rework. Not to use Loctite type
27 4.6
heatsink or push pin heatsink
28 4.7 JPE propose to have extended plastic cover for TIM to outside the Heatsink body
29 4.8 JPE propose to have clearance distance for component underneath Heatsink
JPE propose to have standardize one type of screw per assembly / model and can be magnetize(not using stainless
30 4.9 steel)
31 4.10 JPE propose to have screw head and design standardize among all AVL
32 4.11 JPE propose to have standardize of standoff length and type per assembly / model
33 4.12 JPE propose to use SMT stand-off instead of press fit standoff
JPE prefer EMI metal gasket inbuilt to the connector / cage
34 4.13
Avoid using elastomeric rubber gasket as it drops easily and torn off during handling
35 4.14 JPE prefer foam type gasket. Avoid metal type gasket. EMI Shield Susceptible to Damage.
36 4.15 JPE propose for small pieces of Mechanical part to pre-assemble at supplier side
37 4.16 JPE propose Insulator for Chassis to be pre-assemble at supplier side
38 4.17 JPE propose to have pre assembled EMI shield with component at supplier side
39 4.18 JPE propose to use Gap pad instead of Thermal grease type
40 4.19 JPE propose for Paint surface has to be protected by protective film at supplier
41 4.20 JPE propose to have standardization of Anchor clip to one type per product / family
42 4.21 JPE concern of Heatsink surface with uneven design cause wrong orientation during assembly
43 4.22 JPE propose to have Positioning mark on Chassis to place 5 in 1 or 6 in 1 label
JPE propose to have De-boss/stepdown label location at bottom side to prevent scratching or damage the label along
44 4.23
process
JPE propose for Mechanical part such as chassis,top cover and etc to have scan able barcode from supplier side for
45 4.24 assembly tracking and located at easy access area to scan.
JPE propose for Mechanical part such as chassis,top cover propose to have mylar/protective cover from supplier side
46 4.25
to eliminate scratches issue
47 4.26 JPE required standoff guide for mating board.
48 4.27 JPE propose to have Enlarged lightpipe's label hole at face plate for easy removal and replace whenever having defect
49 4.28 JPE propose for Dimm Card and Battery locate at easy access area to remove and replace.Not to interfered with front
face plate
JPE propose for Mech Part with wire to have exact wire length and secure with sleeve for easy wire management
50 4.29
neat and tidy
51 4.30 JPE Propose to have distance(keep out area) away from the heatsink clip area to prevent chip component damage
52 4.31 Standoff require higher torque force to avoid top level screw loose issue
5 DFM
53 5.1 JPE propose to avoid thicker solder mask design close to 15.7mils fine pitch QFN
54 5.2 JPE propose for PTH FHS must meeting LD+20mils of DIMM Connector leads. Prefered36 mils instead of 28mils
55 5.3 JPE propose for PCB Length >600mm has shrinkage issue. Fine pitch parts to be moved towards center zone of PCB
56 5.4 Mounting Hole with white circle legend with specific distance.
5.5 Nomenclature too near to the fine pitch component’s pad influenced printing quality.
Label
1.1
New design Remarks

Current Design Proposal Advantages (Cisco and JPE)
Offline Label Barcode Printing JPE propose to use Laser  Long Lasting
and need to paste many Barcode Engraving on Cisco  High Quality
labels. PCBA  High Productivity
 High Precision
 No Label rework
 No man power
Current Propose/Example
Label
1.2
Current Design Proposal New design Remarks

Advantages (Cisco and JPE)
4/5/6 in one Label Pasting on Label Pasting on primary  Low label defects
bottom side of chassis. surface to have convenient  High Productivity
access for scanning and  Low Touches
tracking process.  Design for
automation
Standardize among
Current
all cisco product
Propose/Example
5 in 1 label pasted at bottom of chassis Uluru 16 (68-100385) pasted label at top
side
Label
1.3

Multiple individual standalone JPE propose to consolidate  Low Cosmetic

labels label on chassis side individual labels onto 5 in 1 reject
surface.  High Quality
 High Productivity
 Low Rework
Standardize among
Propose/Example
all cisco product
Current 471-100356-01:LBL,BLANK,68 Cost Saving
PN,S/N,PIDVID,COO,CHINA RoHS
LOGO,CE,VCCI,RCM, Name/Address
Label
1.4

Unique labels for each label are JPE propose to have scan able  Prevent Wrong
non bar-coded yet the chassis Barcode (different favor) is Part
part number are the same. require for overlay, agency  Standardization
label, PID label and etc.  High Productivity
 Design for
automation
Current
Label
1.5
New design Remarks

After stiffener and heat-sink JPE propose to have SN # and  No Additional

assembly, both serial number Assembly # label on PCBA to be handling
and assembly label are difficult on a visible / accessible  High Productivity
to scan because located at the location for scanning close to  High Precision
rear side. front faceplate  Manufacturing
Friendly
Label
1.6

Separate SN and 73 # label JPE propose to use 2 in 1 (73 +  Cost Saving

used SN) label to save cost and area  Save area for
of pasting label. pasting label
-To ensure PCB legend and  High Quality
label size are tally as problem  Reduce Handling
Current found on Dijon 9 where label and Pasting time.
471-00013-01:LBL,BLANK,PRIMARY SN
BARCODE,PCBA size is bigger from the legend  Standardize among
471-00014-01:LBL,BLANK,1.25" x and hitted guide rail all cisco product
0.25",PN BARCODE,PCBA
Propose/Example
471-00490-
02:LBL,BLANK,73+SN,BARCODE,1"x0.2"
Label
1.7

Some of DIMM card label are JPE propose for all dimm cards  Avoid wrong
pasted at bottom side position and E-usb need to have scan DIMM
and giving difficulty for able barcoded CPN label and  Visual
scanning process. While some facing up after installed. management
of the E-usb did not have **EDCS-597698 are referred**  Traceability
barcoded CPN label  High Quality
Current
 No Additional
handling
 Design for
automation
 Standardize among
all cisco product
Label
1.8

PID label similar look, same JPE propose to have different  Correct part use
background color, white font overlay color and font for  High Productivity
and identical size. similar look product.  Visual
management.
Propose to design PID label with
 manufacturing
dedicated unique background color for friendly
each model to avoid mixing and wrongly
used.
Label
1.9

JPE observed FVT test script JPE propose to have  Prevent Wrong Info
required information which is standardization product family  Standardization
not accessible and visible for label information to suit FVT  High Productivity
scanning at Test chamber. test script required  Design for
information. automation
 Manufacturing
Propose/Example friendly
68 Assy #, PID #, CLEI, 73 #,SN
Label
1.10

JPE observed multiple type of JPE propose to have only one  Prevent Wrong Info
raw label from Cisco BOM to type of raw label which used  Standardization
use on 4 in 1, 5 in 1 and 6 in 1 across all to reduced down the  High Productivity
which is referring to the same controllable variables.  Design for
x-y size. automation
All these label are running  Manufacturing
Cisco AVL: under low operation friendly
i- WORLDMARK temperature at functional test
ii-CYMMETRIK where doesn’t run through any
reflow or wave soldering oven.
Label
1.11

Most of the Mechanical part As part of mechanical part  Prevent Wrong Info
came with part number without traceability improvement and  Standardization
label. prevent mix in multiple similar  High Productivity
PID, ALL Mechanical Part need  Design for
to come with Part Number with automation
barcode LABEL paste on part’s  Manufacturing
visible area. Also, this LABEL friendly
must include inside mechanical  Parts Traceability
drawing.
PCBA Design
2.1
New design Remarks

Header, RF Connector, Mictor JPE propose to remove all  Manufacturing

Connector, Reed Switch, RFID unused components (ex friendly
still populated on PCBA even Headers, Mictor conn, RFID etc)  Standardization
during –A0 released. before or during -A0 release  High Productivity
Headers potential to induce  Design for
damage and lifted pad issue to automation
PCBA  Cost saving
current
DC Board
MB Board
PCBA Design
2.2

Chips components surrounded JPE propose to avoid chip  Ease rework

by tall components.JPE facing components mounting in process
difficulty to reworks when between or surrounding by tall  High Productivity
there is a failure related to components.  Manufacturing
chips component. friendly
 High quality
current
PCBA Design
2.3
New design Remarks

Battery holder having a strong JPE observed Battery Holder  Ease rework
holding force and potential lifted pad issue and propose to process
inducing lifted pad during have battery holder with  High Quality
battery removal. additional Ground pad at  High Productivity
center for solid bonding with  Manufacturing
PCB. Battery and Battery holder friendly
should be separate part #.
Current.
- Reduce battery holding force
51-6392-01:GNLHW,BATTERY for easy removal
HOLDER,1.433"L,0.63"W,0.294"H,LCP Battery holder might need to
be customize for Cisco product.
PCBA Design
2.4

Observed current design with JPE propose to eliminate wave  High Quality
wave process especially for process - Migration of Wave  Easy to rework
Dimm card connector. Potential soldering process to SMT and  Manufacturing
to induce boards scrap during press fit or Paste in Hole Friendly
rework. Annular ring damage. concept.
Current. Propose/Example
26-100261- 26-1241-
01:SKT,MMRY,DIMM,DDR4,BLACK 01:SKT,DIMM,DDR3,240P,ST,1.5V,0.39C,B
HOUSING & LATCH ,142.0 Lx6.5 LACK HSNG & LATCH 5.80MM
Wmm,288 P,ST,TH,29.0 V,0.85 mm C,-55.0 WIDE,22.39MM MAX LATCH HT,PF TO
to 85.0 C 2.4MM THICK PCB
Use in 73-14544-08 :PCA,MBRD,N7K,
APEX, EVERLAND Heavy MB SUP3
PCBA Design
2.5
New design Remarks

Mouse bites tab is adjacent to JPE propose to move all router  Prevent debris
the connector position. tabs/Mouse bites away from  Damaged
Potential to impact components/connectors  High Quality
connectivity of connector due  High Productivity
to dust or debris from router
process.
Current.
Potenza Daughter card.
PCBA Design
2.6

Applied Chem Mask for bottom JPE propose to eliminate Chem  High Quality
side mating connector to avoid Mask process for BTB (change  High Productivity
during top side reflow drop off nexlev to others type of  Manufacturing
issue. component i.e infinix or Hirose) friendly
or no BTB connectors at
bottom side.
Current.
PCBA Design
2.7

JPE found that some of the raw JPE concern on raw component  Manufacturing
component having a different orientation packaging and pitch friendly.
orientation packaging and pitch to be standardize among all  High Quality.
among all qualified supplier. AVL  High productivity.
current
Part Number : 24-219177
Description:Induct,Ferr,4.7uH,20%,1.5A,S
MD2
Manufacturer Name :MAG LAYERS
PCBA Design
2.8
New design Remarks

JPE observed there a re a case JPE concern that all component  Manufacturing
where terminals size are not especially inductor should have friendly.
tally among 2 AVL supplier a same terminal size among all  High Quality.
AVL supplier.  High productivity.
Current.
24-2955-
01:INDUCT,PWR,0.35UH,20%,47A,SM,394
4(0.81mOHM DCR MAX)
PCBA Design
2.9

JPE facing an issue with dimm JPE prefer to have a standing  Manufacturing
card contact that potentially (90deg) Dimm card installation. friendly.
caused by insertion method.  High Quality.
There are a variant of Dimm  High productivity.
card insertion method for  Standardization
slanting, flat or standing
Dimms.
Propose/Example
Standing Dimm card insertion
Manual Assembly
3.1

2 different types of Xcede JPE propose same physical  Wrong part

connector with same physical outlook connector with minor prevention
outlook. Only has difference in resistance differences - need to  Top Tool
resistance value. standardize on same board Standardization
 High productivity,
able to do Gang Press
to increase UPH
Mechanical Assembly
4.1
New design Remarks

JPE implement offline Colour JPE propose to use same CPN  Avoid wrong eUSB
label prepping for visual for E-usb or Dimm card in same installed side by side
management on E-usb as a board / family. This is to avoid  Visual
process control. wrong E-usb/Dimm installed management
side by side.  No Additional
handling
current
Mechanical Assembly
4.2

JPE observed some of the JPE propose that design for  High Quality.
ejector are having a direct Ejector should not have direct  Manufacturing
contact/touching the face plate contact/touching face plate to friendly.
where potentially induce prevent scratches or mark.  Low rework
scratches/mark Ejector and face plate should
have a clearance
Current
Mechanical Assembly
4.3

JPE observed ejector lever for JPE concern rubbing effect of  Low Cosmetic
N7K models causing rubbing ejector lever onto face plate. reject
effect at face plate. Temporary Propose to remove rib from  High Quality
for containment action JPE ejector handle to avoid scratch  High Productivity
pasted a blank label and  Low Rework
remove prior to ship.
current
Mechanical Assembly
4.4

JPE found that ejector handle -JPE concern of Ejector handle High Quality
rubber are easily drop off and rubber easily drop off, Handle  Standardization
handle loose Loose and Faceplate overlay
easily cause dent/scratches or
current gouge. Propose to not apply to
new model with similar design.
-Propose to look onto others
robust design
Mechanical Assembly
4.5

JPE facing a difficulty to insert / JPE propose to have enough  Reduce risk of
remove socket type connector clearance for wire insertion as component damage
in small and congested area. insulator easily to torn during  Design for
cable tie assembly. automation
current Propose to look onto others  High Quality
alternative design if possible.
-Propose to have spacing 1”
clearance on socket type
connector for easy insertion
and removal process.
-Proper Wire dressing spell in
62 level drawing
Mechanical Assembly
4.6

JPE observed there are 5 Types JPE prefer to use Heatsink type  High Productivity
of Heat sink used in Cisco with Screw or TIM pad design -  High Quality
Product. easy to assembly and rework.  Low Cosmetic
(Glue with activator, Push Pin, **Not to use Loctite type Reject
Wire clips, Pressure sensitive heatsink or push pin heatsink**  Reduce Scrap
adhesive & Screw type)  Design for
automation
current  Standardization
Mechanical Assembly
4.7

JPE observed a plastic to cover JPE prefer to use have a  High Productivity
the TIM and adhesive is not protruding plastic for visual  High Quality
protruding out for certain confirmation of removing of Reduce Scrap
heatsink the cover and having a  Design for
better/proper heat dissipation automation
Current on installed heatsink to BGA’s  Standardization
Not good. potential to fail at FT if plastic
cover is not removed
Good:
Plastic can be visualise if not remove from
the heatsink
Mechanical Assembly
4.8

JPE observed that some of the JPE propose to have clearance  High Quality.
component underneath and distance for component  Manufacturing
surrounding the heatsink did underneath Heat sink. As per friendly.
not have sufficient clearance. Cisco PG we will required  Reduce damage
adequate space around and scrap
component to allow heatsink
size and mounting hardware.
Mechanical Assembly
4.9

Multiple Screw Types In Single JPE propose to have  Prevent Confusion

Models. standardize one type of screw  Standardization
per assembly / model and can  High Quality
be magnetize(not using  High Productivity
stainless steel)  Design for
current
automation
Mechanical Assembly
4.10

Different vendor with different JPE propose to have screw  Prevent Confusion
screw design. head and design standardize  Standardization
among all AVL  High Quality
 Design for
automation
current
Mechanical Assembly
4.11

2 or more different type of JPE propose to have  Prevent Wrong Part

standoff per PCBA used standardize of standoff length  Standardization
and type per assembly / model  High Productivity
 Design for
automation
current
Mechanical Assembly
4.12

Some of Cisco Product are use JPE propose to use SMT stand-  Process Simplify,
press fit stand off or pem nut off instead of press fit standoff use reflow process.
where might have a potential  Reduce Scrap
of over press and scrap the  High Quality
boards.  Eliminate potential
defect such as over
press standoff.
Current Propose/example  Automated.
50-1687- 50-1919-
01:STDF,RND,5.56mmD,M2.5x4.30mmL,C 01:STDF,RND,5.56mmD,M2.5x0.45x4.3m
SwMatteSn,PFIT mL,CSwSN,Reflow Soldered
Mechanical Assembly
4.13

Loose Elastomer Gasket. JPE prefer EMI metal gasket  Low Cosmetic
Elastomer Gasket design which inbuilt to the connector / cage reject
used across most of models are Avoid using elastomeric rubber  High Productivity
easily dropped off from the SFP gasket as it drops easily and  Low Rework
cage Connector . torn off during handling  High Quality
 Design for
automation
current Propose/example
On Tianshan model, SFP cage with new

SFP cage with elastomeric rubber
gasketing concept.
Mechanical Assembly
4.14

EMI Shield Susceptible to JPE prefer foam type gasket.  Low Cosmetic
Damage. EMI shield easily Avoid metal type gasket. EMI reject
damage especially during slot Shield Susceptible to Damage.  High Productivity
in and out friction with the  High Quality
tester due to lot of small hole  Reduce Handling
opening area that giving  Design for
opportunity of shield bent and automation
finally damage while friction Propose/Example
with other surface.
current
Metal type EMI shield Foam Material
Foam :
Polyurethane
Fabric : Nickel Tape : Hi-

Proposal Use NRS Ecogreen temp tape
(Foam Type Profile
Shielding)
Mechanical Assembly
4.15

Small pieces part for ejector JPE propose for small pieces of  Prevent Missing
assembly.JPE need to create a Mechanical part to pre- Part
Mini BOM for off-line assemble at supplier side  High Productivity
preparation ejectors.  High Quality
 Reduce Handling
 Low rework
current
Complete ejector after prepping off line
Mechanical Assembly
4.16

2 CPN supply/purchase JPE propose Insulator for  High Quality

separately and need to Chassis to be pre-assemble at  Reduce Handling
assemble in JPE before supplier side and Pasting time.
mechanical assembly process.  Manufacturing
friendly
 Reduce off-line
Propose/Example
preparation
current
800-45609-01:ASY,MECH,SPEEDRACER
Where 700-105760-
01 :FABPLSTC,INSULATING
BARRIER,MAIN BOARD,SPEEDRACER
supply under 800 # by supplier.
Insulator
Base
Mechanical Assembly
4.17

EMI shield missing and easily JPE propose to have pre  Low Cosmetic
pop out. assembled EMI shield and reject
insulator with component at  High Productivity
supplier side  Low Rework
 Reduce Handling
current
(CPN :700-32591-01)
 Design for
automation
Mechanical Assembly
4.18

1.3cc of Fujipoly applied on JPE propose to use Gap pad  Low Cosmetic
Luke48 & Ricard NG chassis at instead of Thermal grease type reject
PCB bottom side (Mirror to  High Productivity
Santa Monica) as heat  Low Rework
dissipation.  Reduce Handling
Example: 700-104196-01
Mechanical Assembly
4.19

Some of the chassis or top JPE propose for paint surface  Manufacturing
cover with paint surface did not has to be protected by friendly
have a protective film to protective film at supplier  High Quality
protect from scratches during  Standardization.
assembly, testing or  Low cosmetic
transportation along the defect
process. Propose/Example
700-39009-02:FABMTL,STMP,chassis,
nightster
Mechanical Assembly
4.20

Variance of anchor clip design JPE propose to have  Foolproof Hook

and tend to mixed up. standardization of Anchor clip  High Quality
to one type per product /  Impossible to
Single lap, risk to popped out. family popped out
(refer below figure) -Proposed to have double laps  Standardization
ends which could eliminated
the pin popped out due to
torsional impact.
CURRENT USED
PROPOSED ANCHOR CLIP ANCHOR CLIP
AVG = AVG = 9.17kg

37.30kg
End clip with DOUBLE roll which brought the total

combined width THICKNESS > PCB hole. End clip with SINGLE roll only has 0.026"
versus 0.03" of PCB hole.
Mechanical Assembly
4.21

Heatsink surface with uneven JPE propose to have Heatsink  Manufacturing

design cause wrong orientation design in even surface/height. friendly
during assembly.  High Quality
Standardization
current
Mechanical Assembly
4.22

No positioning mark to place 5 JPE propose to have positioning  High quality

in 1 label or others label mark on Chassis to place 5 in 1  Standardization
or 6 in 1 label.  Uniformity and
accurate position.
Propose/Example
example of Position Mark

Mechanical Assembly
4.23

No step down/de-boss at label JPE propose to have  High quality

pasted area. Labels potentially De-boss/stepdown label  Standardization
damage or peel off due to location at bottom side to
direct contact with table prevent scratching or damage
surface the label along process
Propose/Example
Proposed de-boss area
Mechanical Assembly
4.24

JPE observed some of the JPE propose for Mechanical  High Quality
mechanical part such as chassis part such as chassis, top cover Manufacturing
and top cover did not have a and etc to have scan able friendly
scan able barcode from barcode from supplier side for  High Productivity
supplier. This barcoded CPN is assembly tracking and located  In cooperated with
needed for shop floor tracking at easy access area to scan. shop floor system.
system.
Propose/example
Top cover inner side

Mechanical Assembly
4.25

Found handle scratches and JPE propose for Mechanical  Low Cosmetic
dent after functional test or part such as chassis, top cover reject
during transportation along the propose to have  High Quality
process. mylar/protective cover from  High Productivity
supplier side to eliminate  Low Rework
scratches issue
current
scratches
Mechanical Assembly
4.26

Without proper standoff guide JPE required standoff guide for  Manufacturing
during MB and DC mating mating board. friendly
cause damage during mating.  High Quality
Propose/Example:
700-25524-
01:FABMTL,BRKT,GUIDE,PCB,.55" TALL
Mechanical Assembly
4.27

Label is fix before light pipe sub JPE propose to have Enlarged  Reduce Scrap
assembly. When ever having a light pipe's label hole at face  Low Cosmetic
defect on label, need to plate for easy removal and Reject
dismantle light pipe assembly replace whenever having  High Productivity
defect at label.  High Quality
Current  Standardization
Mechanical Assembly
4.28

Connectors and battery close JPE propose for Dimm Card and  High quality
to chassis face plate. Battery locate at easy access  Standardization
Manufacturing concern which area to remove and replace. Manufacturing
will have difficulty to slot in Not to interfered with front Friendly
DDR4 cards or remove for face plate
rework when needed.
current
Dimm’s card
Battery
Face plate
Mechanical Assembly
4.29

No sleeve to hold the wire JPE propose for Mechanical  High Quality
assembly in-tact. Small wire are Part with wire to have exact  Wire management
loose and free hanging before wire length and secure with neat and tidy.
assembly process. sleeve for easy wire  Reduce scrap
management neat and tidy
current
Mechanical Assembly
4.30

Chip component been knocked JPE Propose to have  High Productivity

off during heat sink installation distance(keep out area) away  High Quality
using anchor clip. from the heatsink clip area to  Low Cosmetic
prevent chip component Reject
damage  Reduce Scrap
current
 Design for
automation
Mechanical Assembly
4.31

Same thread standoff and Standoff require higher torque  High Productivity
screw with same torque force force to avoid top level screw  High Quality
at vertical screwing found loose issue.  Low Cosmetic
screw easily loose. Require Cisco update into 62 Reject
drawing  Reduce Scrap
 Design for
automation
5 to 6.8 in/lbs
8.3 to 11 in/lbs
DFM
5.1

JPE observed there are a solder JPE propose to avoid thicker  Increase Printing
mask legend near to 15.7mils solder mask design close to Process window
fine pitch QFN pad. 15.7mils fine pitch QFN.  High Quality
 Low Rework
current Propose/Example
DFM
5.2

DFM violation as the Dimm JPE propose for PTH FHS must  Ease rework
conn Pins diameter is 16mils meeting LD+20mils of DIMM process
and PTH hole diameter 28 mils. Connector leads. Prefered36  High Quality
mils instead of 28mils  High Productivity
 Manufacturing
friendly
current
DFM
5.3

For long PCB length >600mm JPE propose for PCB Length  Ease rework
JPE encountered issue for >600mm has shrinkage issue. process
solder printing misalignment. Fine pitch parts to be moved  High Quality
towards center zone of PCB  High Productivity
 Manufacturing
friendly
current Propose/Example
Uluru 16 MB having a length >600mm
95-0650-01 Rev J6 Spec

DFM
5.4

Component near/close to Mounting Hole with white  Ease rework

mounting hole (screw hole for circle legend with specific process
PCB bottom potential damage distance.  High Productivity
during Chassis assembly. Propose for Cisco design a  High Quality
white circle legend with 1”
distance clearance as image
show.
current
Propose/Example
DFM
5.5

The component nomenclature Propose to move the CRD  Ease rework

too near against the fine pitch legend/ nomenclature far from process
pad which influence the the fine pitch pads.  High Productivity
printing quality and induced  High Quality
short and bridging.
Example : CRD
legend of R5126 CRD legend +
too near to the fine green mask
pitch QFN.
DLEAN

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DLEAN GENERIC ITEMS DLEAN

New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Multiple individual standalone JPE propose to consolidate  Low Cosmetic

Current Design Proposal New design Remarks

New design Remarks

After stiffener and heat-sink JPE propose to have SN # and  No Additional

Current Design Proposal New design Remarks

Separate SN and 73 # label JPE propose to use 2 in 1 (73 +  Cost Saving

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

New design Remarks

Header, RF Connector, Mictor JPE propose to remove all  Manufacturing

Current Design Proposal New design Remarks

Chips components surrounded JPE propose to avoid chip  Ease rework

New design Remarks

Current Design Proposal New design Remarks

New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

2 different types of Xcede JPE propose same physical  Wrong part

New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Multiple Screw Types In Single JPE propose to have  Prevent Confusion

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

2 or more different type of JPE propose to have  Prevent Wrong Part

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

On Tianshan model, SFP cage with new

Current Design Proposal New design Remarks

Fabric : Nickel Tape : Hi-

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

2 CPN supply/purchase JPE propose Insulator for  High Quality

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Current Design Proposal New design Remarks

Variance of anchor clip design JPE propose to have  Foolproof Hook

AVG = AVG = 9.17kg

End clip with DOUBLE roll which brought the total

Current Design Proposal New design Remarks