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Fabrication Process: - Crystal Growth - Doping - Deposition - Patterning - Lithography - Oxidation - Ion Implementation
Fabrication Process: - Crystal Growth - Doping - Deposition - Patterning - Lithography - Oxidation - Ion Implementation
•Crystal Growth
•Doping
•Deposition
•Patterning
•Lithography
•Oxidation
•Ion Implementation
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VLS I DES IGN LAB
Fabrication- CMOS Process
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VLS I DES IGN LAB
Fabrication: Crystal Growth
Czochralski Method
Basic idea: dip seed crystal into
liquid pool
Slowly pull out at a rate of
0.5mm/min
controlled amount of
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VLS I DES IGN LAB
Fabrication: Oxidation
Quartz Tube
Silicon Dioxide has several uses:
- mask against implant O 2 or Water
Pump Wafers
or diffusion Vapor
- device isolation
- gate oxide
- isolation between layers Quartz Carrier
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VLS I DES IGN LAB
Fabrication: Ion
Implantation
Precise control of dopant
Good for shallow junctions and threshold adjust
Dopant gas ionized and accelerated
Ions strike silicon surface at high speed
Depth of lodging is determined by accelerating field
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VLS I DES IGN LAB
Fabrication: Deposition
Used to form thin film of Polysilicon,
Silicon dioxide, Silicon Nitride, Al.
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Fabrication:
Metallization
Standard material is Aluminum
Deposition techniques:
Vacuum Evaporation
Electron Beam Evaporation
RF Sputtering
1. Prepare Reticle
Use projection like system:
-Precise movable stage
-Aperture of precisely rectangular size and angular orientation
-Computer controlled UV light source directed to photographic plate
After flashing, plate is developed yielding reticle
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Fabrication:
Lithography
Printing
Printing
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Lithography: Mask
making
Electron Beam Technique
System resembles a
scanning electron microscope +
beam blanking and computer
controlled deflection
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Patterning/ Printing
Process of transferring mask features to surface of the silicon wafer.
Optical or Electron-beam
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Patterning: Pwell mask
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Patterning/ Printing
SiO2
substrate
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Fabrication Steps
Inspect, measure
Post bake
Etch
Strip resist
Printer align expose
mask
Apply PR
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Fabrication Steps
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VLS I DES IGN LAB
Fabrication Steps: P-
well Process
VDD
Diffusion
P+
P+
Vin
P well Vo
n+ n+ p+
p+ p+ p+
n+
n+
Substrate n-type
P well
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VLS I DES IGN LAB
Fabrication Steps: P-
well Process
VDD
Diffusion
P+
P+
Vin
P well Vo
n+ n+ p+
p+ p+ p+
n+
n+
Substrate n-type
P well
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VLS I DES IGN LAB
Fabrication Steps
n+ n+
p+ p+
P well
n+ n+ p+ p+
P well
Substrate n-type
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Fabrication Steps
Oxidation oxide
Substrate n-type
Substrate n-type
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Fabrication Steps
Diffusion: p dopant,
Removal of Oxide
P-well
Si3N4
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Fabrication Steps
Patterning: Diffusion (active)
mask
P-well
substrate
substrate
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VLS I DES IGN LAB