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Heat Sink
Heat Sink
Thermal Requirements
Target temperature requirements for each component with heat load
CPU case Temperature – 90°C
MosFET Junction Temperature – 125°C
C624 Chipset case Temperature – 85°C
CAD Model
Heat sink 2
Heat sink
Width – 68mm
Height – 25mm Heat sink 1
Base thickness – 4mm
14 fins, thickness – 1mm
heat sink 3
heat sink 4
Grille same as
outside grilles
Simulations results – Air flow
GPU = 250 W x 2
Flow Out
VR = 2.5 W x 15
CPU Fins
CPU = 165 W x 2 VR = 2.5 W x 15
PCH= 19 W
Main Board
Memory = 7W x 12 Assembly
Front Riser Card
Assembly
Meshing
Simulations Results – Fan Blade Tip Velocity
Velocity (m/s) Analytical Calculation
• Tip Speed velocity can be calculated at 13244
RPM
= pi()*D*N
= pi()*0.06*13244/60
=41.61 m/s
• Tip speed value is close match with CFD
results
Simulations Results – Air flow
Velocity contours through centre of GPU heat sinks