Diffusion Bonding

Diffusion bonding of materials in the solid state is a

process for making a monolithic joint through the
formation of bonds at atomic level, as a result of closure of
the mating surfaces due to the local plastic deformation at
elevated temperature which aids inter-diffusion at the
surface layers of the materials being joined
 Introduction
Diffusion bonding is a method of
creating a joint between similar or
dissimilar metals, alloys, and
nonmetals.
 How does diffusion
bonding work?
Two materials are pressed together
(typically in a vacuum) at a specific
bonding pressure with a bonding
temperature for a specific holding
time.
Experimental Setup
Equipment
MECHANISM
MECHANISM

Sequence for diffusion

bonding a ceramic to a
metal
 a) Hard ceramic and soft metal
edges come into contact.
 b) Metal surface begins to
yield under high local stresses.
 c) Deformation continues
mainly in the metal, leading to
void shrinkage.
 d) The bond is formed
MECHANISM
PROCESS PARAMETERS

Bonding temperature
 Typically 50%-70% of the melting
temperature of the most fusible metal in
the composition

 Raising the temperature aids in the

inter-diffusion of atoms across the face
of the joint.
 PROCESS PARAMETERS
Bonding pressure
 Forces close contact between the edges of the
two materials being joined.

 Deforms the surface asperities to fill all of the

voids within the weld zone .

 Disperses oxide films on the materials, leaving

clean surfaces, which aids the diffusion and
coalescence of the joint.
 PROCESS PARAMETERS

Holding Time
 Always minimized
 Minimizing the time reduces the physical force on the
machinery.

 Reduces cost of diffusion bonding process.

 Too long of a holding time might leave voids in the

weld zone or possibly change the chemical
composition of the metal or lead to the formation of
brittle intermetallic phases when dissimilar metals or
alloys are being joined.
Advantages of diffusion
bonding
Properties of parent materials are generally
unchanged.
Diffusion bonding can bond similar or dissimilar
metals and nonmetals.
The joints formed by diffusion bonding are generally
of very high quality.
The process naturally lends itself to automation.
Does not produce harmful gases, ultraviolet radiation,
metal spatter or fine dusts.
Does not require expensive solders, special grades
of wires or electrodes, fluxes or shielding gases.
 LIMITATIONS
Great care is required in the surface preparation stage.

The initial investment is fairly high and production of large

components is limited by the size of the bonding
equipment used.

The suitability of this process for mass production is

questionable, particularly because of the long bonding
times involved.