OSRAM AD838L / AD830R

Globetronics AD8930UV
outstanding issue update
09072009
Tony Lui
Objective
 Buyoff :
 Clear OSRAM AD838L CTM OSL before 9/9
 Clear OSRAM AD830R OSL

 General support:
 Solve Globetronics AD8930UV(April 06) hard disk corrupt cannot startup
issue
 Solve Inari AD830, AD838 OSL
 Multi-chip verify in Inari AD830

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 2

OSRAM AD838L CTM Outstanding List update
SW (CTM stated payment deadline 9/9) ---------SW 7.00.29 will release on 9/9 4:00p.m.

 Epoxy search boundary display

 Available, however displayed boundaries stay on screen and display position shifted
 Panel exist sensor SW
 If 1st slot panel exist error during loading magazine  upper platform pusher not return, align pusher not on
 Clear track more than once sometimes hold up at testbond screen (9/3)
 1 die wafer search
st

 Global align angle message not close after Change wafer

 Stamping module crash issue
 After upgraded to 7.00.27 and go to stamping position page, temp. solved if LF data page refreshed
 Dispense LF map enable scenario is reported by A.H.Tan, solved in 7.00.25
 Access level amendment request by CTM in ww35: technician mode need to able to access exit

 (New) Magazine tilt sensor, if tilted, track not clear next time, 2 LF jammed afterwards.

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 3

OSRAM AD838L CTM Outstanding List update
HW
 Polarizer light box
 Setting test: Loose threshold settings under new panels mass run on Helios sampling
 Dust, scratch and epoxy can be detected
 0 wrong reject other than the above items in single panel 784 units
 YT Lee Released new OPR of 01-67133-02, 01-67132 for the rest 4 field machines
 Chan Koon Man released new DI for 2 new machines with the polarizer

 New Vacuum cleaner (S/O:90543A01):

 Hidy sent out on 9/8/2009, pending tracking number from Hidy
 4th generation elevator guide(S/O: 90091):
 9/9, Vincent Chan in-house modifying, 9/10/2009 will sent out
 ESD material elevator rails (S/O:89338):
 Originally 9/4/2009..pending
 750um stamping pin (S/O:85263C01 for 2 new MC, S/O:90340 for field MC cancelled, S/O:90999):
 9/11/2009..manufacturing issue..pending delivery

 Operation, PM manual received on 9/9/2009 Open items

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 4

AD838L Polarizer Rejected case log verification on pre-bond
substrate inspection settings

Scratch

Foreign
material

 Comment:
 using 90% polarized blue ring light, 8 exposure, very loose setting,
 Results positive, No over wrong reject inside the 10 reject unit1 panel test (784 units)
 The rejected units were main scratch, Foreign material
 Follow up: called 4 sets (01-67133-02 and 01-67132 ) in OPR and 2 sets in DI

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 5

AD838L Uplook verification
 Condition:
 7.00.15 SW, (7.00.27 unable to unlock uplook menu)
 5x5 FOV uplook optics (conventional uplook optics is 3x3 FOV)
 6x6 FOV bond optics
 Local alignment
 Calibration done on uplook:
 COR
 Zoom auto Calibration
 Aligned uplook theta with Bond Arm X, Y axis (best align with substrate, however only BA is available for align)
 According to Hei Man Previous report, Extra tighten the mounting screws and adjustment screws to verify
 Post bond Results

Post bond results X SD, range Y SD, range T SD, range Uph
(um) (um) (degree)
Without Uplook 1.710, 8.960 2.360, 12.140 0.073, 0.36 6.7K
With Uplook 2.185, 9.650 2.279, 10.810 0.090, 0.44 5.8K
 Comment: no significant changes in SD, ranges, UPH decreased 0.9K
 Moreover, Y mean is shifted from -2 to -33 um after enabled uplook
 Requested OSRAM side to measure in smartscope, pending results

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 6

Measurement result by smartscope
 Smartscope measured with better results for uplook camera

Smartscope results X SD, range Y SD, range T SD, range Uph

(um) (um) (degree)
Without Uplook 6.7K
With Uplook 5.8K
uplook self test
’ø”©ú®

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 7

Results with/without uplook
 Without uplook

 With uplook

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 8

Panel crack reported by production 9/7/2009
 2 panels cracked on Blizzard LED machine in 9/4
and 9/7 respectively
 According to report by production
 Kicker jam happen
 2 Panel is jammed together during output

 Observation
 2 Panels crack at left border, 1 at top right corner and middle
 Jam sensor working, if jam happens, system unable to continue
test run unless home kicker
 Magazine tilt error will left substrate in track and no kick out
after tilt error
 Suspected reason
 SW
 Action
 Suggested record down operators action on the first jammed
substrate next time

 Request SW debug for

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 9

AD830R OSL issues
 Epoxy on die issue
 On site SW verify on 9/7/2009, intermittently disconnect / block air tube 5 times with missing die/ BH clog
error generated normally, results positive for SW signal checking
 Flow Signal tracking, suspected signal instability, results shows large bond delay has
 S/O: 90419 flow sensor UGK sent from AAA on 9/7/2009
 Plan install on 9/10
 Meeting on 9/9/2009

 Post bond 2 new stop mode SW test

 Received SW on 9/8 night, plan to test 9/10
 MC #51 SO board burnt for “no blow” solenoid, need replacement,
 Plan to install on 9/10

 UPH <12K in single row package issue

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 10

AD830R epoxy on die issue
 Symptom
 Epoxy on die happened in every 50K
 3 mode of epoxy on die
 Epoxy climb up at side of the die
 Contaminated collet
 Stacked die at bond side
 Suspected reason
 Epoxy too thick at epoxy disc side
 Collet shift, collet decay
 Machine unable to detect or alarm user after missing die/ BH clog
 SW detection timing
 Sensor Hardware sensitivity
 Pneumatic stability
 Mis-operation after missing die/ bond head clog

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 11

Observations
 Collet is delicate
 Collet is deformed from 5mil to 4mil ID (flow from 112 to 91) during
production
 Die not at collet center
 Found at 9/7/2009 morning, collet picked a die but missing die error
happened due to die shift and air leak
 Wafer optics was found zoom in /out will shift ¼ of screen which is >30mil
 Ejector hole is shifted, rotation of die also solved after adjustment
 Ejector up level is too high
 85um thick die is using 200um ejector up level
 160 up level can pick up without missing die
 Suggest to use 160 ejector up level

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 12

AD830R epoxy on die issue flow signal study
 Flow control signal monitoring on 9/7/2009 on MC #51

 About 65 ms after vacuum on again entering stable state

Refill
vacuum
Solenoid signal
Release overshoot
overshoot state
state

Stable
state
Flow sensor
Ideal Flow signal signal

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 13

Effect of vacuum flow by BHX, BHY, BHZ motion
 Turn on vacuum and dry run BHX, BHY, BHZ
 No observable difference on vacuum flow when BA is moving x,
y, z  no blocking inside BA pneumatics

Testbond with
Idle state enable vacuum enabled
vacuum

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 14

 Test condition
 BHX, BHY, BHZ, BH valve turn on only without actual picking die
 Wave Form
 Bond delay< 22ms release vacuum overshoot is joining the refill vacuum overshoot
 Bond delay >22ms

Bond
delay Bond
22ms delay
30ms

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 15

Suggested actions
 Suggest use

 Regarding to Trace the vision failure cases with the error log
together to know error generated or not during bad units

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 16

Globetronics AD8930UV Hard disk corrupt issue
 Clone hard disk finished on 9/5/2009
 Machine is able to initialize and modules configuration is customized for the old AD8930UV
 Machine passed to technician for setup bonding

 Output LF deform issue reported by technician

 Before hard disk corrupt, the machine was found deform LF said by technician
 Reasons: 1st slot position, column pitch, elevator column pitch not fine tune and rotation of
output elevator cassette, elevator missing steps
 Action:
 Finished fine tune position, pitches
 Results:
 can output for every slot without deform, occasionally Y missing step happens and need reset to restore
 Suggested action
 For missing steps of MMU elevator motors, suggest do PM on the machines, temporarily
can reset elevator once to restore missing steps

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 17

Inari AD830/AD838 CTM Outstanding List
update
HW
 AD830 Piston for better epoxy level detection (Penang SO#: 250002017, S/O: pending):
 Received, need demonstration to CTM on epoxy level detection
 AD838 Window clamp for avoiding 1 st row hit collet (S/O:89925A02):
 9/9 delayed, pending new delivery date
 AD838 Fix clamp for avoid Substrate bring back(S/O:89925A02):
 9/9 delayed, pending new delivery date
 AD838 vacuum hole anvil block(S/O:89925A02):
 9/9 delayed, pending new delivery date
 AD838 wafer cover (S/O: 88539)
 Cancelled

SW
 AD830 Multi-chip feature debug… need verification with Process Cheah by A.H.Tan
 AD830 SW standardization, (all AD830 should be capable to use latest SW, will do after multi-chip debug finish)
 AD838 LF mark implementation… pending Tse Kai Yin, Tang Liang Hong

Internal discussions
 Epoxy too large issue
 Reset elevator magazine jam intermittently issue
 SW: AD838 Clear bond track without clear memory intermittently.., cannot repeat in field and in-house, suggested Ronald demonstrate the issue to Tang
Liang Hong on 9/9

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 18

Inari AD830 epoxy dispense too large issue
 Symptom
 Dispensing epoxy coverage too large for their package
 Even take epoxy filled nozzle to stamp without pressure, epoxy is already too large
 Target coverage and dot size
 4 side coverage without hitting border
 In practical, around half die size epoxy will give a pass coverage, i.e. 300um dot size for
600um dies
 Observation
 Dispense epoxy shows normal coverage but already exceed pad border
 For Sumitomo CRM 1295, the viscosity is lower than other package ablebond 8-41 epoxy,
300um epoxy ID nozzle will generate 400 um epoxy, which is too large for their 600um die
 Inari Process Cheah feedback there was void inside syringe during material coming
 Suspected reason
 10 mil nozzle is too large to handle the CRM 1295 epoxy and to fulfill the small coverage
requirement in this package
 Suggestion
 CTM has 8mil, 10mil nozzles, suggest use a 8mil nozzle instead of 10mil to test

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 19

Parameters for 0 pressure “stamp” after nozzle
filled with epoxy
 Pressure 0.003MPa, vacuum -1.0kPa
 Pre-sqeeze delay: 50ms
 Squeeze time: 3ms
 Exhaust time: 3ms
 Post squeeze delay: 3ms

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 20

Picture demonstration on Dot size large issue
 Epoxy Filled Nozzle with 0 pressure “stamp”
 Epoxy dot shape
 Only the nozzle ID area has epoxy and already too large

 Coverage
 Normal coverage, just able to cover die corners
 Epoxy too much and exceed the pad border

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 21

Schedule
 AD838L OSL follow up
 Continue checking panel crack issue
 Global epoxy setup
 Uplook smartscope measuring results
 Installation and testing of 4th generation elevator guide (Sent out on 9/9)
 Installation of vacuum cleaner x 5 on all field AD838L (Sent out on 9/8)
 AD830R
 Repair SO board
 Test AD830R new post bond mode SW
 Epoxy on die issue
 Upgrade HW flow sensor on 9/10

Jan 10, 2023 ASM Pacific Technology Ltd. © 2009 page 22