COOLING ENHANCEMENT OF

DISC SHAPED ELECTRONIC

COMPONENTS USING NANO
FLUID  FLUID
• PROJECT SUPERVISOR S7 ME 1 GROUP 12
• MR .MELVIN JACOB ADHARSH RAJ
• ASSISTANT PROFFESOR BINOSH M 
• MBCET ASWINTH S KUMAR
ADARSH S NAIR
 • Electronic components like processors are rapidly
increasing day by day on electronic devices
• With the current market resistance to widely embrace
advanced methods such as liquid cooling, air cooling will
continue to be a popular choice
INTRODUCTI • Electronic systems, from a large computer to a small desktop are a
ON collection of various materials embedded in a multitude of
geometrical configurations. This combination, along with the
exponential increase in power dissipation and packaging density,
has made cooling problems challenging. 

• All electronic devices and circuitry generate excess heat and thus

require thermal management to improve reliability and prevent
premature failure.
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS

A comparative study on • The nanofluid 0.5% of AL203 in water was

best configuration for found to be  most suitable for heat
heat enhancement using extraction in porous blocks, straight free
nanofluid channels and wavy free channels
• It had the lowest friction coefficient and
highest thermal efficiency for porous and
Clihttps://doi.org/ wavy 3 channel
10.1016/
j.ijft.2020.100041ck to
add text
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

Heat Transfer in
Nanofluids—A Review Ratio of thermal conductivity of
nanoparticle to base fluid had
maximum value for the combination
https://doi.org/10.1080/0 ‘Cu0 and ethylene glycol’ with
1457630600904593
increasing volume fraction of nanofluid.
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

Impact of nanoparticle • Nanoparticle shape like

shape on platelets and cylinders have
thermohydraulic comparatively  higher heat
performance of a transfer coefficient, h than Os
nanofluid in an enhanced and bricks.
microchannel heat sink • However, the pressure drops in
for utilization in cooling of pellets and cylinders is so high
electronic components that the ratio of heat transfer to
pressure drop of pellets and
https://doi.org/10.1016/j. cylinders is very low as
cjche.2020.11.026
compared to that of bricks and
Os
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

• The thermal stresses and cooling
Vascularization for performance of a circular plate can be
cooling and reduced improved simultaneously by embedding
thermal stresses vascular cooling channels with increasing
volume fraction.
• Mechanical strength and cooling
doi:10.1016/ performance improve as the design changes
j.ijheatmasstransfer.2014 from radial to tree-shape
.09.027
LITREATURE SURVEY

JOURNAL DETAILS                                                               MAIN FINDINGS​

Constructal design of • Dendritic channels are not advisable due to

reverting microchannels pressure drops at forks and difficulties in
for convective fabrication
cooling of a circular disk •  Proposes radial microchannels over dendritic
ones
https://doi.org/10.1016/j.ij
thermalsci.2011.01.014
PROBLEM STATEMENT

• Several methods are employed for cooling electronic components

today which include heat sinks, thermoelectric coolers, forced air
systems and fans, heat pipes and others.
• Machining microchannels into electronic components and passing
nanofluids through them is one such method.
• However, temperature range, nano particle shape, base fluid
type, particle - base combinations and mass flow rate have not yet
been analysed simultaneously.
 OBJECTIVES

• Effective cooling of a electronic component

using nanofluid

• To find the best combination of nano particle

and base fluid for cooling purpose

• To find efficiency at different cooling

temperatures

• To find efficiency of cooling at different mass

flow rates
 METHODOLOGY

Step 1 – Refer journals  and literatures to find optimum design for microchannel, electronic
component disk shape and nanofluid

Step 2 – Find effective nanofluid mixture for cooling electronic component made of Silicon
of various shapes like slab, disc, cubic using ANSYS Fluent software.
- By altering boundary conditions,different nanofluids ,volume fraction and temperatures

Step 3- Plotting graphs based on the above results obtained from ANSYS Fluent based on
the objectives
Step 4- Machine microchannel into disk from VSSC  using the dimensions provided

Step 5 –   Preparation of different  nanofluid  (cu0 + ethylene glycol and al203 +

ethylene glycol )in  lab at correct volume fraction 

Step -6  - Suitable pressure sensor ,temperature sensor ,small portable pump
and related equipment are made or manufactured

Step 7 -  Conduction of experiment and recording of observation and result

numerically and experimentally
DESIGN OF DISK
DESIGN OF COLLECTOR
              THANK YOU