Increase 40% Efficiency in selective

soldering machine Novo-102 ECU Module

Victor Garcia

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 Define Phase

Project Goal
• Increase 40% Efficiency in selective
soldering machine Novo-102 ECU
Module

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 Six Sigma Team Members
Champion: Carlos Marin General Manager

Team: Carlos Vela Yellow belt Process Engineer

Green Belt Process Engineer supervisor
Juan Rubio
Mario Guzman Yellow QC Engineer.
Yafar Martinez Yellow Production Manufacturing Engineer

Rodolfo Mateo Team Leader De Group.

Consulting Members/Customers MBB: Loon Kok Tan.

1-3
 Six Sigma Project Tracking
D
Project Y is: Reduce PPM by needle hit wire ( 13-181)
M
Project Y Business Impact Stakeholder
Project Charter
A
Selected Link Requirements
I
Define C
7/15/19 7/15/19 7/15/19 7/15/19
Kickoff Preliminary
Meeting
Process Map C & E Matrix FMEA
Capability & MSA

Measure
8/1/19 8/1/19 8/22/19 8/22/19 8/22/19
Multi-Vari
Initial FMEA Studies

Analyze Completed - On time

9/22/19 9/22/19 Completed - Behind

DOE (or other Started

tool)
Mistake Proofing Final FMEA
Improve
10/2/19 10/2/19 10/2/19
Control Plan Hand Off Training Final Capability Owner Sign-off Final Project Report

Control
10/1/19 10/2/19 10/3/13 10/10/13 10/15/13
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 Project Charter
Business Case   Problem Statement:  
           
Genther Mexico has a high demand on ECU modules ACT Over the last 9 month the PPMS has out of specification in
Gentherm use 3 different selective soldering machine: Geentherm Mexico. The top # 1 (soldering bridges) because a
KISS-101, NOVO-101 and Selective soldering made in new ECU of 9 through-hole cavities until now the root causes
Gentherm welding process is one of the more complex process could not be detected ends up to extraordinary high scrap
in Gentherm costs/waste.
This process is the critical process and is one of the more
expensive machine in ECU Area. Goal Statement:  
     
Reduce the Top Number One failure in Genther Mexico
(soldering Bridges ) which contributes 47 Pzs per week out of
defect caused according to the Pareto Analysis. Best approach
will be a production process based on Six Sigma level for the
overall soldering area .
           
Project Scope:   Team Roles:  
           
In Scope:     Champion: Juan Rubio  
      MBB: Loon Kok Tan  
selective soldering machine NOVO -101 ECU AREA GB: Alejandor Luebano
soldering Machine number: -Novo-102 A01316-200 Team: Carlos Vela, Mario G. Yafar Martinez, Juan
  Rubio
       
 
 
       
Out of Scope:   EoD:
.

 (Expert on Demand)    
     
     

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Baseline Data

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 D
High Level Process Map
M
A
I
C

INPUTS BIG Project Y

Think 6 M's INPUTS OUTPUTS
Man Operator training
Machine Selective soldering KISS-101
Material Material cleaning
Loading and unloading of PCBA / harness
Soldering
Method PPMs due to missing soldering in secondary side of the PCBA
Measure Welding Machine Setup PCBA/harness
Mother Earth

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D
M
A
Low Level Process Map
Process:
I
Soldering PCBA/harness

C Training experience
Process Inputs (X) Type
NC
Process Step Output (Y)

Training consciousness NC
Training skills NC
Material flux crystallized NC
Method Slag cleaning NC Cable tinning PPMs due to mising soldering in secondare side of the
Method number of circuits to be tinned NC PCBA
Method cleaning of flux excess NC
Mother Earth lighting NC
Method soldering temperature NC

Training experience NC
Training consciousness NC
Training skills NC Insertion of cables into PPMs due to mising soldering in secondare side of the
Method fixture size bigger than necessary NC the PCBA holes PCBA
Method wear cavities NC
Method cavities inadequate in circuits gripping NC

Training experience NC
Training consciousness NC
Training skills NC
Very high machine NC
Very low machine NC Load of fixture with PPMs due to mising soldering in secondare side of the
Machine adjustment of rails very open C PCBAs in KISS machine PCBA
Machine adjustment rails very closed C
Setting machine stops very open NC
Setting machine stops very close NC
Undefined method in handling fixture NC

Training experience NC
Training consciousness NC
Nozzle cleaning flux method undefined NC
Cleaning method for deposit of flux undefined NC Flux aplication PPMs due to mising soldering in secondare side of the
Material flux Life Expectancy ended NC PCBA
Drop jet height machine very low NC
Machine preheated of flux NC

Training experience NC
Training consciousness NC
Machine height of the fountain very high C
Machine height of the fountain very low C
Method nozzle type NC PPMs due to mising soldering in secondare side of the
Method nozzle cleaning NC PCBA
Method fixture cleaning NC
Method cable stripping too long NC
Method cable stripping too short NC
Soldering of PCBAs
Machine fixture design NC
with harness
Machine amount of N2 very low C
Method pot cleaning undefined NC
Machine speed for soldering nozzle very high C
Machine speed for soldering nozzle very low C
Machine soldering temperature very high C
Machine soldering temperature very low
Method maintenance for fixture undefined
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C
NC
Method circuits location NC
Method safety guard C
D
M
A
Third Level Process Map
I Process:
C
INPUT
Process Inputs (X) Type Process Step Output (Y) Think 6 M
Pot temperature C Good tining Man
Correct method of tin NC Machin
separate wires NC Materia
scrap due to soldering bridges Method
Estañado de alambres Measur
Mother Ea

correct method of insertion cables NC correct flux aplication

Correct distance of insertion in PCBA C
Good sujetion of cables NC
insertion of cables into
scrap due to soldering bridges
the PCBa

Correct flux centering C correct flux aplication

Correct flux amount C
Clean flux C
Drop jet dispenser clean NC Flux Application scrap due to soldering bridges

temperature parameters C good soldering

correct position of nozzle C
correct nozzle height C
correct nitogen parameters NC
limpiesa de soldadura NC 1-9
clean solder NC
scrap due to soldering bridges
D
M Quick Wins
A
I
C
Still
pending to
review all
files with
this issue..

Review all soldering files

where we have now 3
programs with password
and eliminate 7 obsolete

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D
M Quick Wins
A
I
C Still pending to
review nozzle
dimension because
the pcba with 9
cavities does not
have enough space

Review all nozzle

available and now
we have 1 nozzle 9
mm

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Before QW

1-12
Improvements Charts ( I –MR) After Quick Wins

After QW

Before QW

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D Cause and Effect Matrix

M C&E Matrix
A
I
C

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D
M Initial FMEA
A
I
C

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D
M MSA
A
I
C

• Two Operators from soldering machines was chose.

• 8 Bad pieces were selected ( soldering bridges).
• 8 Good pieces were selected.
• First operator should inspect each part and determinate whether it is acceptable
or unacceptable ( Randomize data).
• Record results for each part, keep parts separated, because we need to know
which results came from which part.
• Also second operator inspects each part.
• The two operators inspect the parts once and then have to perform a second
inspection.

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D
M MSA
A
I
C
mesure system Evaluation

Qty of Samples EVA CARLOS

1 11 bad 7 good 13 bad 14 bad
2 14 bad 12 bad 14 bad 6 good
3 15 bad 11 bad 7 good 1 good
4 13 bad 14 bad 6 good 11 bad
5 10 bad 15 bad 10 bad 7 good
6 2 good 16 bad 2 good 9 bad
7 8 good 1 good 16 bad 2 good
8 12 bad 6 good 3 good 12 bad
9 3 good 3 good 15 bad 16 bad
10 4 good 2 good 12 bad 3 good
11 7 good 10 bad 11 bad 8 good
12 5 good 5 good 4 good 10 good
13 16 bad 13 bad 1 good 15 bad
14 9 good 4 good 8 good 13 bad
15 1 good 9 bad 5 good 4 good
16 6 good 8 good 9 bad 5 good

• 16 parts was selected ( 8 bad & 8 good).

• 2 operators
• Inspect same parts twice.
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D
M RunOrder Parts
MSAOperators replica rating
1 11 Eva 1 bad

A 2 14
3 15
4 13
Eva
Eva
Eva
1 bad
1 bad
1 bad

I
5 10 Eva 1 bad
62 Eva 1 good

C
78 Eva 1 good
8 12 Eva 1 bad
93 Eva 1 good
10 4 Eva 1 good
11 7 Eva 1 good
12 5 Eva 1 good
13 16 Eva 1 bad
14 9 Eva 1 bad
15 1 Eva 1 good
16 6 Eva 1 good
17 13 Carlos 1 bad
18 14 Carlos 1 bad
19 7 Carlos 1 good
20 6 Carlos 1 good
21 10 Carlos 1 bad
22 2 Carlos 1 good
23 16 Carlos 1 bad
24 3 Carlos 1 good
25 15 Carlos 1 bad
26 12 Carlos 1 bad
27 11 Carlos 1 bad
28 4 Carlos 1 good
29 1 Carlos 1 good
30 8 Carlos 1 good
31 5 Carlos 1 good
32 9 Carlos 1 bad
33 7 Eva 2 good
34 12 Eva 2 bad
35 11 Eva 2 bad
36 14 Eva 2 bad
37 15 Eva 2 bad
38 16 Eva 2 bad
39 1 Eva 2 good
40 6 Eva 2 good
41 3 Eva 2 good
42 2 Eva 2 good
43 10 Eva 2 bad
44 5 Eva 2 good
45 13 Eva 2 bad
46 4 Eva 2 good
47 9 Eva 2 bad
48 8 Eva 2 good
49 14 Carlos 2 bad
50 6 Carlos 2 good
51 1 Carlos 2 good
52 11 Carlos 2 bad
53 7 Carlos 2 good
54 9 Carlos 2 bad
55 2 Carlos 2 good
56 12 Carlos 2 bad
57 16 Carlos 2 bad
58 3 Carlos 2 good
59 8 Carlos 2 good
60 10 Carlos 2 bad
61 15 Carlos 2 bad
62 13 Carlos 2 bad
63 4 Carlos 2 good
64 5 Carlos 2 good

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D
M MSA
Assessment Agreement Date of study: 10/1/2019
A Reported by:Victor Garcia
Name of product: solder bridge

I Misc:

C Within Appraisers
100 95.0% CI
Percent

95

90

Percent
85

80

75

70

Eva Carlos
Appraiser

As we can see the results base on Kappa

analysis is above 0.4.
We can determinate that our
Data is trustful.

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D
Main Effect & Interaction Plot Chart For Important X’s
M
A
I
C

Cube Plot (fitted means) for PPMs

6 2 5 1

6 3 5 1
300

temperatura
6 3 4 0
17

velocidad
6 2 5 -0
290 10
6000 9000
flux

4.5 9
nozzle

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D
M Improvement Phase
A
I Why DOE ?
C

2^4 Factorial DOE Create by Minitab 16 to be

run. ( the Full Factorial design)
StdOrder RunOrder CenterPt Blocks flux velocidad temperatura boquilla results
7 1 1 1 6000 17 300 4.5 6
16 2 1 1 9000 17 300 12 0
14 3 1 1 9000 10 300 12 0
6 4 1 1 9000 10 300 4.5 1
3 5 1 1 6000 17 290 4.5 6
10 6 1 1 9000 10 290 12 0
12 7 1 1 9000 17 290 12 0
13 8 1 1 6000 10 300 12 6
9 9 1 1 6000 10 290 12 6
4 10 1 1 9000 17 290 4.5 1
11 11 1 1 6000 17 290 12 5
1 12 1 1 6000 10 290 4.5 6
5 13 1 1 6000 10 300 4.5 6
2 14 1 1 9000 10 290 4.5 1
15 15 1 1 6000 17 300 12 5
8 16 1 1 9000 17 300 4.5 0

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 Analysis of DOE PPMs Main Effects Screener for PPMs
Summary Report
Pareto Chart of the Effects Data Means
Effects Pareto
(response is PPMs, α = 0.05) Look for panels with large differences between levels.
Isolates the most important effects.
nozzle velocidad
Term 80331 flux

A Factor Name 800000

D A flux nozzle

BCD B temperatura
600000
C velocidad
ABC temperatur
D nozzle
BD
400000
AD velocidad

B
BC 200000 0 250000 500000

PPMs
4.5 9.0 10 17 Effect
CD temperatur flux
Effect is defined as the largest
C mean minus the smallest mean.
AC 800000

ABCD
Colors based on effect size, in
ACD standard deviations:
600000
AB Larger than 2

ABD Between 1 and 2

400000
Smaller than 1
0 100000 200000 300000 400000 500000 600000 700000
Effect 200000
290 300 6000 9000
Lenth’s PSE = 31250.1

Cube Plot (fitted means) for PPMs

1000000 333333 833333 166666

1000000 500000 833333 166666

300

temperatura
1000000 500000 666666 0
17

velocidad
1000000 333333 833333 0
290 10
6000 9000
flux

4.5 9
1-22
nozzle
 Ppms

Microsoft
PowerPoint Presentation LEAN Project in module Area

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 D
M What we Learn from the DOE
A
I
C the lesson learned in the DOE
It is the interaction that the
Surface Plot of PPMs vs temperatura, flux variables have with each other and
we can appreciate which are the
Hold Values
velocidad 13.5
nozzle 6.75

ones that are of the greatest

800000

PPM s 600000
importance and it really provides us
400000

200000
300
with a more concrete view of the
problem to be solved so that you
295
6000 temperatura
7000
800 0 290
f l ux 9000

can attack the problems that really

matter and that significantly impact
on reducing the ppms and they help
us to continuous improvement

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 D
M Improvement Plan
A
I
C

Phase Improvements
Reduce novo machine programs from 7 programs without password only 3
1 programs with password.
Identify and update the correct flux injection point for PCBA , 4-6 , 7 and 9
2 cables.
3 Update nozzle from 12 to 9 mm.
4 Update WI with the new program's names.

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D
M Improvement Plan
A
I
C
Final PFMEA Process/Product
Failure Modes and Effects Analysis
(FMEA)

Pag
Process or Product Name: ECU Modules Y soldering bridges Prepared by: Victor Garcia e
_1_
Responsible: Victor Garcia FMEA Date (Orig) _9/30/2019__ (Rev) _______00______

Team Members : Yafar Martinez Carlos Vela Juan Rubio

S O D R S O D R
Process Step Key Process Input Potential Failure Mode Potential Failure Effects E Potential Causes C Current Controls E P Actions Recommended Resp. Actions Taken E C E P
V C T N V C T N

How well can

cause or FM
What is the process step What is the Key Process In what ways does What is the impact What causes the What are the existing What are the actions for reducing Whos What are the completed

How Severe is

you detect
How often does
cusotmer?
the effect to the
Input? the Key Input go on the Key Output Key Input to go controls and procedures the occurrance of the Cause, or e actions taken with the
wrong? Variables wrong? (inspection and test) that improving detection? Should Respo recalculated RPN? Be
(Customer prevent eith the cause or have actions only on high nsible sure to include
Requirements) or the Failure Mode? RPN's or easy fixes. for the completion
internal Should include an SOP recom month/year
requirements? number. mend
Update WI with new
Insertion of cables into the programs / software
Method cavities inadequate out of spec 10 cavity wear 8 Preventive Maintenance 6 480 10 2 4 80
PCBA holes with password /update
nozzle in machine

Update WI with new

Cleaning for deposit of contaminated
flux
Flux aplication
flux waste in drop
Cleaning drop Jet
Machine height of the
fountain
programs / software
10 empty container 8 visual inspection 6 480 10 2 5 100
container with password /update
nozzle in machine
Update WI with new
programs / software
10 lack of cleanliness 8 visual inspection 6 480 10 2 5 100
jet with password /update
nozzle in machine
Update WI with new
programs / software
to low 10 wrong set up 8 settings machine 6 480 10 2 5 100
with password /update
nozzle in machine
Update WI with new
programs / software
to high 10 wrong set up 8 settings machine 6 480 10 2 5 100
with password /update
nozzle in machine

Update WI with new

inappropriate programs / software
nozzle type 10 wrong set up 8 Preventive Maintenance 6 480 10 2 5 100
nozzle with password /update
Soldering of PCBAs with nozzle in machine
harness
Update WI with new
waste in the operator did not programs / software
nozzle cleaning 10 8 Preventive Maintenance 6 480 100
nozzle follow MI with password /update
nozzle in machine 10 2 5
Update WI with new
programs / software
to low 10 wrong set up 8 settings machine 6 480 100
with password /update
nozzle in machine 10 2 5
Method cable stripping
Update WI with new
programs / software
to high 10 wrong set up 8 settings machine 6 480 100
with password /update
nozzle in machine 10 2 5

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 Control Plan

Control Plan

Process: soldering proces Revision Date

Author: Victor Garcia Contributors: Juan Rubio, Carlos Vela , Yafar Martinez, Mario Guzman rev 0 2-Oct-19
Phone:700-7000 ext 364
Process Owner Approval:

Input / Process Historic Historic

Measurement Reaction Plan
Process Process Step Variable Name Output Specification Cp / Cpk MSA & Sample Size Sample Frequency Control Method
Technique (contact / action)
(I/O) (LSL, USL, Target) & (date) (date)
Insertion of cables into the QC audit /module team
Pcba holes correct insertion subjection 0mm, .05mm, 1 mm Audit 1 Daily Check list
programs updated / process
Flux aplication position of aplicarion Position XY Z set up 1 One time sofware engineering
soldering procces
soldering of PCBa with programs updated / process
harness position of soldering Position XY Z set up 1 One time sofware engineering

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Future Plan & Knowledge

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