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Chapter 1 Material Science
Chapter 1 Material Science
Chapter 1 Material Science
MATERIAL SCIENCE
Topics
1.1 Atomic structure and crystal structure
1.2 Solidification
Chapter 2
Chapter 3
Chapter 4
Chapter 9
• 1.1 Atomic structure
• 1.2 Crystal structure
Understanding
materials….
Properties
“Materials Science” “Materials Engineering”
Structure Processing
Adapted
from Fig. 2.6,
Callister 6e.
• Primary bonding
• Ionic (ceramics – some covalent)
• Covalent (polymer C=C bonds)
• Metallic (metals)
• Secondary bonding (weaker)
• Van der Waals (polymers)
• Hydrogen (similar to VdW)
Na (metal) Cl (nonmetal)
Unstable unstable
electron
Nastable
(cation) - Cl
+ Coulombic (anion)
Attraction stable
Ionic bonding –
examples
NaCl
MgO
H He
2.1
Be CaF2 O F
-
Li 3.5 4.0 Ne
1.0 1.5 CsCl Cl -
Na Mg 3.0 Ar
0.9 Ti Cr Fe Ni Zn As Br -
1.2 1.8
K Ca 1.5 1.6 1.8 1.8 2.0 2.8 Kr
0.8 1.0 I -
Rb Sr 2.5 Xe
1.0 At -
Ba
0.8 2.2 Rn
Cs 0.9 -
0.7 Ra
Fr
Give
0.9 up electrons Acquire electrons
0.7
Ionic bonding –
characteristics
• Bonding is:
• Non-directional
• Relatively strong
• Material properties:
• Often ceramic (e.g. Alumina, Al2O3)
• High melting points (e.g. 2,200°C)
• High elastic modulus (e.g. E=400 GPa)
• Brittle (difficult for atoms to slide/ rearrange)
• Electrical and thermal insulators (no free
Covalent bonding –
origin
• Stable electron configurations by sharing electrons between
atoms
• Shared electrons belong to both atoms
• Typically non-metal compounds (polymers C-C & C-H bonds)
column IVA
H2 F2
C(diamond)
He
H
Cl2
2.1
Li Be
SiC C O F
-
Ne
1.0 1.5 2.5 2.0 4.0 -
Na Mg Si Cl Ar
0.9 1.2 1.8 3.0 -
K Ca Ti Cr Fe Ni Zn Ga Ge Br Kr
0.8 1.0 1.5 1.6 1.8 1.8 1.8 2.8 -
Rb Sr Sn As I Xe
0.8 1.0 1.6 1.8 1.8 2.5 -
2.0
Cs Ba Pb At Rn
0.7 0.9 1.8 2.2 -
Fr Ra
0.7 0.9 GaAs
Covalent bonding –
examples
• Compounds containing elements on
right side of table (GaAs, Si3N4)
• Non-metallic molecules (H2, Cl2)
• Some elemental solids (Si, C)
• C – Diamond
• Prevalent in polymers
• Occurs in ceramics
Covalent bonding –
characteristics
• Bonding is:
• Directional (exists in specific orientation)
• Very strong
• Material properties:
• Often polymers, glasses and ceramics (e.g. Diamond)
• Less dense than ionic/metallic bonded materials (directional
bonding makes is harder to
‘pack’ atoms)
• High elastic modulus (e.g. E~1000 GPa)
• High melting point (e.g. 3,550°C)
• Brittle (strong, directional atomic bonds)
• Electrical and thermal insulators
• …But polymers have low melting point and stiffness?...
Metallic bonding –
origins
• Metals and alloys
• Low number of valence electrons (1, 2, 3 from
each atom)
• Valence electrons become delocalized
• Electrons are not bound to any
particular atom
Variable Directional
Covalent large-Diamond (semiconductors, ceramics
small-Bismuth polymer chains)
Variable
Metallic large-Tungsten Nondirectional (metals)
small-Mercury
Directional
Secondary smallest inter-chain (polymer)
inter-
molecular
Bonding in
materials
Ceramics Large bond energy
(Ionic & covalent bonding): large Tm
large E
3D Structures 2D Structures
Few more 2D Structures:
Crystal Structure: (Amorphous)
(8 x 1/8)+
• Atoms contact(6 x ½)
each other
across cubic face diagonal
= 4R
Therefore, lattice
4constant
atoms a =
2
After F.M. Miller, “Chemistry: Structure and Dynamics,” McGraw-Hill, 1984, p.296
Hexagonal Close-Packed (HCP)
Structure
• The HCP structure is represented as an atom at each of 12 corners of a
hexagonal prism, 2 atoms at top and bottom face and 3 atoms in between top
and bottom face.
• Atoms attain higher APF by attaining HCP structure than simple hexagonal
structure.
• The coordination number is 12, APF = 0.74.
Figure 3.8 c
After F.M. Miller, “Chemistry: Structure and Dynamics,” McGraw-Hill, 1984, p.296
After F.M. Miller, “Chemistry: Structure and Dynamics,” McGraw-Hill, 1984, p.296
1.2 Solidification
● The crystallization of a large amount of material from a single
point of nucleation results in a single crystal.
● Single crystals are produced only under carefully controlled
conditions
● The expense of producing single crystal materials in only justified
for special applications – turbine engine blades, solar cells,
piezoelectric materials
● When a single material begins to solidify, multiple crystals begin
to grow in the liquid and a polycrystalline solid forms
1.2 Solidification
● The growth of crystal is known as nucleation, and the point
where it occurs is the nucleation point
● At the solidification temperature, atoms of a liquid, such as
melted metal, begin to bond together at the nucleation point and
start to form crystals
● The final sizes of the individual crystals depend on the number of
nucleation points
● The crystals increase in size by progressive addition of atoms and
grow until they impinge upon adjacent growing crystal.
1.2 Solidification
1.2 Solidification
● In engineering materials, a crystal is usually referred to as a grain
● A grain is merely a crystal without smooth faces because its
growth was impeded by contact with another grain or a
boundary surface.
● The interface formed between grain is called a grain boundary.
● The atoms between the grains (at the grains boundaries) have no
crystalline structure and are said to be disordered.
● Grains are sometimes large enough to be visible under an
ordinary light microscope or even to the unaided eye
● Rapid cooling generally results in more nucleation points and
smaller grains
● Slow cooling results in larger grains which have lower strength,
hardness and ductility.
1.3 Crystalline imperfections in solid
Why knowing solid imperfections is important?
● Screw
dislocation:
Formed by a
shear stress
that is applied
to produce
the distortion
1.3 Crystalline imperfections in solid
Dislocation-linear defects
● The upper
front region of
the crystals is
shifted one
atomic
distance to
the right
relative to the
bottom
portion
1.3 Crystalline imperfections in solid
Dislocation-linear defects
Mixed dislocation:
Most dislocation found in crystalline are neither pure edge nor pure
screw, but exhibit components of both types, terms as mixed
dislocation
1.4 Phase diagram
1.4 Phase diagram