Technical Road Map

ITEM UNIT 2023 2024 2025 2026

LAYER COUNT L 10 18 24 36

TRACE / SPACE ㎜ 0.080 / 0.080 0.075 / 0.075 0.070 / 0.070 0.070 / 0.070

Small Via Hole ㎜ 0.250 0.225 0.200 0.150

S/M Open / DAM ㎜ 0.050 / 0.175 0.050 / 0.125 0.050 / 0.100 0.060 / 0.075

B.DRL STUB ㎜ 0.254 ± 0.20 (Max. 0.45) 0.254 ± 0.20 (Max. 0.45) 0.200 ± 0.15 (Max. 0.35) 0.200 ± 0.15 (Max. 0.35)

IMPEDANCE % ± 10 ± 10 ± 10 ±8

Min. Core Thickness ㎜ 0.100 0.100 0.075 0.050

Total Thick. Max. ㎜ 2.0 2.4 3.0 4.0

Aspect Ratio (0.25Φ) 比 8.0 9.5 12.0 16.0

Drill to Copper mm 0.200 0.200 0.175 0.150

Special METAL PCB, CEM-3, Low Loss Material, Teflon, VIPPO, ENIG, OSP, I.TIN, I.Silver, LF HASL

1
Raw Materials AVL

MASS materials SAMPLE materials DEVELOPMENT materials

PTFE PTFE
PTFE

PANASONIC TUC Ultra Low loss

MEG-7 TU933 (T3) Df < 0.004

PANASONIC TUC ISOLA Very Low loss

MEG-6 TU883 I-TERA
MEG-6G
Df : 0.004 ~ 0.008

PANASONIC TUC ITEQ SHENGYI Low loss

MEG-4 TU-872SLK IT958G S7439
FR4 Df : 0.008 ~ 0.014
MEG-4S

TUC Middle loss

ITEQ NOUYA SHENGYI
TU-863
IT170GRA2
TU862HF
NY3150HC/HF S1150G Df : 0.014 ~ 0.020

SHENGYI ITEQ DOOSAN NOUYA Standard loss

TUC
S1000H, S1000-2M TU768 IT180A DS7409S NY2140, NY2150 Df > 0.020
S1141 NY2170

SHENGYI
CEM S2600F, S2155G, ST210G

ALUMINUM
METAL GBE JINGHONG VENTEC WAZAM AJU STEEL 1060, 3003, 4045,
BA20, BA30 JHAF02 VT-464, VT-4B3 HA-80 A-5000N(H) 5052, 6061