CLASSIFICATION OF MEMORIES

1. Register, Main Memory and Secondary Memory

Ex: Microprocessor registers, ROM IC’s and Hard drive, pen drive

2. Sequential Access Memory & Random Access Memory

Ex: Tape Cassette and CD

3. Static and Dynamic Memory

Ex: Registers & MOS cells and Semiconductor dynamic ram cells

4. Volatile and Non-Volatile Memory

Ex: RAM and ROM

5. Magnetic and Semiconductor Memory

ROM – READ ONLY MEMORY
 Permanent Binary Information Storage.
TYPES OF ROM
1. Maskable ROM:
 Permanently programmed during manufacturing process.
A photographic negative called amsk is used to control the electrical connection on the
chip.

2. Programmable ROM (PROM):

 Programmed by customer.
 Once programmed can’t reprogrammed.

3. Erasable PROM (EPROM):

 Erased and Reprogrammed
 Erased by passing UV light.
 particular data can’t be erased

4. Electrically Erasable PROM (EEPROM):

 Selective data can be erased.
RAM – RANDOM ACCESS MEMORY
WRITE AND READ OPERATION
Write:

Read:
TIMING WAVEFORM
TIMING WAVEFORM
STATIC RAM CELL
 Memory that stores data and retains it as long as power is applied is called Static memory.
 Types - Bipolar RAM Cell, MOSFET RAM Cell

Bipolar RAM Cell:

• The X & Y select line is used to select a
particular cell in a memory matrix.

• Q1 – ON & Q2 – OFF – data ‘1’ is stored.

• Q1 – OFF & Q2 – ON – data ‘0’ is stored.

To store ‘0’:
• High signal on set input of Q1  turns off Q1
 Turns ON Q2 .
• Q2 collector is low. So the Q1 is kept at off
condition.

To store ‘1’:
• High signal on reset input of Q2  turns off Q2
 Turns ON Q1 .
• Q1 collector is low. So the Q2 is kept at off
condition.
STATIC RAM CELL
MOSFET RAM Cell: