MMIC

TECHNOLOGY
 Microwave Integrated Circuits (MIC’s)

 Microchip for Microwave frequencies.

 It can incorporate innumerable components of different types, (passive and
active) into a small chip to form a complete microwave subsystem.
 Size, weight and cost are reduced much.
 There are three types of circuit elements that either are used in chipform or
are fabricated in MIC. They are:
• Distributed transmission lines (microstrip, strip, etc.)
• Lumped elements (R, L, and C)
• Solid state devices (FETs, BJTs, diodes, etc.)
 Types of Microwave Circuits
1. Discrete circuit
• Packaged diodes/transistors mounted in coaxial and waveguide
assemblies.
• Devices can usually be removed from the assembly and replaced.
2. Hybrid Microwave Integrated Circuits (HMICs)
• Diodes/transistors, resonators, capacitors, circulators etc., are fabricated
separately on most appropriate material and then mounted into the
microstrip circuit and connected with bond wires.
3. Monolithic Microwave Integrated Circuits (MMICs)
• Diodes/transistors, resistors, capacitors, microstrip etc., are fabricated
simultaneously, including their interconnections, in semiconductor chip
 MMIC (Monolithic Microwave Integrated
Circuits)
 The world monolithic is derived from the Greek letter monos (Single) and
lithos (stone). Thus a monolithic integrated circuit is built on a single
crystal.
 MMICs, or Monolithic Microwave Integrated Circuits, are a type of
integrated circuit (IC) device that operates at microwave frequencies (300
MHz to 300 GHz).
 These devices typically perform functions such as microwave mixing,
power amplification, low noise amplification, and high frequency
switching.
 MMICs are dimensionally small (from around 1 mm² to 10 mm²) and can
be mass produced, which has allowed the proliferation of high frequency
devices such as cellular phones.
 This makes them easier to use, as cascading of MMICs does not then
require an external matching network.
 The substrate of an MMIC must be a semiconductor material to
accommodate the fabrication of active devices and devices consisting,
several layers of metal, dielectric and resistive films.
 Potentially, the MMIC can be made at low cost because the manual labour
in the fabrication of hybrid MICs is eliminated and that a single wafer can
contain a large number of circuits, all of which can be processed and
fabricated simultaneously.
Comparison Between Monolithic and Hybrid
MMIC
 Analog components in MMIC

 Many analog circuits require the use of capacitor and inductor.

 They are used:
 To adjust the signal phase.
 For impedance matching the source and load.
 To filter the signal.
 Capacitors in MMIC

 Capacitor may be formed in two ways:

i. Interdigitated capacitor
ii. Overlay capacitor

 Interdigitated capacitor can be formed

on a single layer metal but typ have
capacitance (< 1.0pF).
 The value of capacitance is determined
by the lithographically defined spacing
→ hence dimension difficult to control.
 Overlay capacitor → used when
large area or more precisely
controlled capacitance is
required.
 The common dielectric material
for overlay capacitor is silicon
nitride ().
 Silicon dioxide (), and
polyimide have also been used.
 Inductors in MMIC

 Three methods for making inductors in MMICs.

i. Straight line inductors
ii. Single loop (Ω) inductors
iii. Spiral inductors

 Metal thickness in all three types is typ → several microns → to reduce

resistivity and minimize skin loss.
 Straight line inductor → used for
highest frequencies but typ have low
inductance (< 1.0nH)
 Single loop (Ω) inductors → easy to
form but limited to a few nH.
 Spiral inductor can be made for L >
50nH but requires two levels of metal
with underpass.

 This underpass represents an unwanted

capacitance → that must be minimized.
 Air Bridge process

 Air bridge process is often used in forming spiral inductors in MMIC

technology.
 It is typically used to minimize parasitic capacitance.
 The thick polyimide is patterned
on the substrate until exposed
substrate.
 Metal deposition is made
sufficiently thick to ensure lifting
after dissolving the polyimide.
 Air bridges → lowest possible
dielectric, rugged and reliable.
 Gold air bridges can be used for
small MMIC’s because of gold’s
low resistivity.
Spiral Inductor using Air Bridge
Structure of MMIC
MMIC: A typical Monolithic Microwave Integrated Circuits. One
example of a MMIC is 2-40 GHz distributed amplifier with a gain of 4 dB
Photograph of a monolithic integrated X-band power amplifier. This circuit
uses eight heterojunction bipolar transistors with power dividers/combiners at
the input and output to produce 5 watts.
 Materials for Monolithic Microwave
Integrated Circuit
Substrate material :- alumina, beryllia, ferrite/garnet, GaAs, glass, rutile

A substrate of monolithic microwave integrated circuits is a piece of

substance on which electronic devices are built. The ideal substrate materials
should have the following characteristics :
1) High dielectric constant(9 or higher)
2) Low dissipation factor or loss tangent
3) Dielectric constant should remain constant over the frequency range
of interest and over the temperature range of interest
4) High purity and constant thickness
5) High surface smoothness
6) High resistivity and dielectric strength
7) High thermal conductivity
Conducting material :- aluminium, copper, gold, silver.

It should have following properties

1) High conductivity
2) Low temperature coefficient of resistance
3) Good adhesion to the substrate
4) Good etchability and solderability
5) Easily deposited or electroplated
 Dielectric films :- , SiO, , and

Dielectric materials are used in monolithic microwave integrated circuits

for blockers, capacitors, and some couple-line structures. The properties
of dielectric materials should be
1) Reproducibility
2) Capability of withstanding high voltages
3) Ability to undergo processes without developing pin holes
4) Low RF dielectric loss
 Resistive films :- Cr, Cr-SiO, NiCr, Ta and Ti

Resistive materials are used in MMIC for bias networks, terminators and
attenuators.

1) Good stability
2) Low temperature coefficient of resistance(TCR)
3) Adequate dissipation capability
4) Sheet resistivities in the range of 10 to 1000 Ω per square
 Interconnects in MMIC

 At high frequency → Metal interconnect or waveguide must have a

controlled, reproducible impedance.
 Line must be well shielded from each other to avoid cross-talk.
 Line loss must be minimized and finally a stable ground voltage is needed.

 Two choices for fabricating these interconnects:

i. Coplanar interconnect
ii. Microstrip interconnect
 Microstrip Interconnect
 It uses the back of the wafer as ground plane.
 Usually the wafer is thinned from 500µm to 100µm.
 This is done by lapping in abrasive materials such as alumina and silicon
carbide.
 It is then polished using wet chemical.
 The through hole is then patterned and etched with the infrared aligner to
make sure front side and backside is aligned.
 The deposition of gold is made
with the aid of infrared IR camera
to ensure the microstrip is
deposited.
 ADVANTAGE DISADVANTAGES

Most widely used. Line losses are somewhat higher

Excellent integration with chip and with poorer isolation between
lumped elements. circuits.
Multilayers are possible. It is unshielded and some radiation
Ground plane isolate the occurs for thicker substrates
microstrip. depending on dielectric constant
and frequency.
 Coplanar Interconnect

 Coplanar waveguide terminates the field lines associated with waveguide

with parallel ground lines.
 The line must wide and closed to signal line.
 For low-density MMICs, they may be wire
bounded directly to a large ground plane
surrounding the chip.
 ADVANTAGES DISADVANTAGES

Very good integration with chip and Thick substrates are required to
lumped elements. keep structure away from the
Series and shunt connections are chasis.
relatively easy. Integration with multilayers is poor
 Advantages of MMIC
 Low cost (because of the large quantities processed)
 Small size
 Light weight
 High reliability; all components are fabricated simultaneously and there
are no soldered joints.
 Improved reproducibility
 Improved performance
 Disadvantages of MMIC
 Processing difficulties.
 Low yields because of
 The effects of component tolerance & discontinuities.
 Trimming after fabrication is difficult.
 Inherent resistive losses.
 Small size limits heat dissipation.
 Applications of MMIC

1. MMICs are suitable for space and military applications because they meet
the requirements for shock, temperature conditions, and severe vibration.
These are the major factor in the success of MMICs for development of
microwave solid state devices.

2. Communications
 Next generation compact radio
 Optical and broadband microwave
communications
3. Homeland Security Scanners
 Portal security scanners
 Stand-off security cameras for public places
 Handheld detectors for police and special forces

4. Imaging & Sensors

 Missile sensors
 Environmental sensing
 Explosives
 Medical imaging
5. New Applications
 Automotive collision avoidance radar
 Airport runway debris detection
 Helicopter & aircraft blind landing systems
One example of the use of MMIC technology is in
weather radar systems. MMICs are used to transmit
and receive high-frequency signals that can detect
precipitation and other weather phenomena. This data
is then used to create detailed maps of weather
patterns, which can help meteorologists predict severe
weather events and issue warnings to the public.
Another example is in satellite communication, where
MMICs are used to amplify and process signals from
space. This technology enables faster and more
reliable communication between satellites and ground
stations, making it possible to transmit large amounts
of data quickly and efficiently.
 Current Trends in MMIC Technology

One of the most exciting developments in

MMIC technology is the use of Gallium
Nitride (GaN) as a semiconductor
material. GaN has several advantages over
traditional silicon, including higher power
density and efficiency. In fact, GaN-based
MMICs have already been used in military
radar systems and are now being explored
for use in commercial applications like 5G
base stations.
Speaking of 5G, this next-generation wireless technology is also driving
innovation in MMIC design. 5G networks require high-frequency operation,
which presents new challenges for MMIC designers. However, recent
breakthroughs in materials and circuit design have enabled the development of
MMICs that can operate at frequencies up to 100 GHz - well beyond the
capabilities of previous generations. As a result, MMICs are playing a critical
role in the deployment of 5G networks around the world.
 Challenges in MMIC Technology

Developing MMIC technology presents a

number of challenges for researchers and
engineers. One of the biggest obstacles is
thermal management, as high power
densities can cause the device to overheat
and fail. This problem is compounded by
the fact that MMICs are often used in
applications where size and weight are
critical, making it difficult to incorporate
effective cooling solutions.
Another challenge is ensuring the reliability of MMICs, which must operate
under a wide range of environmental conditions. This requires careful design
and testing to ensure that the device can withstand temperature changes,
humidity, and other factors that can affect its performance. Additionally,
MMICs must be able to operate reliably over long periods of time, as they are
often used in mission-critical applications.
 Future of MMIC Technology
The future of MMIC technology is both
exciting and challenging. As the demand for
faster, more efficient, and reliable electronic
devices continues to grow, MMIC technology
will play a crucial role in meeting these
needs. One of the key trends in MMIC
technology is the use of GaN, which offers
higher power density and efficiency than
traditional materials. This will enable the
development of smaller, lighter, and more
powerful devices.
Another trend is the adoption of 5G networks, which require advanced MMIC
technology to handle the high frequency and data rates. This will drive
innovation in areas such as autonomous vehicles, augmented reality, and smart
cities. However, there are also challenges that need to be addressed, such as
thermal management and reliability. Researchers and engineers are working
on developing new materials and designs to overcome these obstacles.
For example, imagine a world
where your smartphone can
communicate with your car in
real-time, adjusting its speed
and route based on traffic
patterns and road conditions.
Or imagine a network of smart
sensors that can monitor
everything from air quality to
water levels, providing real-
time data to help us make better
decisions about our
environment.
 Conclusion

In conclusion, MMIC technology has been instrumental in the development of

high-frequency communication systems and has found applications in various
sectors. The future of MMIC technology looks promising, with the increasing
demand for high-speed data communication and the growing need for
wireless infrastructure