Assessing Local Deformation using HR-EBSD, ECCI and
HR-DIC Xinrui Huang, Angus J Wilkinson, Phani Karamched
1 Introduction &
•
Aims
Deformation characterisation is important in
materials mechanical property analysis
• Scanning electron microscope (SEM) based non
– constructive techniques are studied
• To bring HR-EBSD and ECCI measurements
together, along with DIC in case studies of
polycrystal deformation
• Compare the experimental results with
simulations by finite element analysis (FEM)
3 HR-EBSD (high resolution – electron backscattered
diffraction)
Figure 4. Workflow of HR-EBSD calculations which extract displacement gradient
tensors from shifts of electron backscattered diffraction pattern (EBSP) zone axes
Use cross-correlation method to determine the shifts
of features in experimental EBSPs from their positions
in a strain-free reference pattern Figure 5. Common
All components of strain and rotation tensors
can be calculated under sensitivity of ± [2]
5 HR-DIC (high resolution – Digital image correlation)
1000 x
Figure 9. HR-DIC results of an in-situ tensile test on Inconel 718 sample with grain size around 15 µm and loaded to ca 5% strain
showing the distribution of in plane nominal strain component e11
6 Correlative Case Study
(a) (b)
(c) (d)
25 µm
Dept. Materials, University of Oxford, Parks Road, Oxford, OX1 3PH
2 Materials & Methods
• Inconel 718 nickel alloy after solutionising heat treatment
• Dog bone tensile test sample design
• Electron beam Platinum deposition speckle patterns
Figure 1. Precipitation time temperature
(PTT) diagram of different phases in
Inconel718 [1]
sample – detector
configuration of
EBSD analysis
Figure 11. (a) CPFEM simulation of total cumulative slip
distribution (b) ECCI image of the grain under best imaging
condition for deformation characterisation (c) Calculation of the
in plane strain e11 from HR-EBSD (d) Calculation of GND
densities from HR-EBSD
Integrated study on the correlation
between localised strain distribution and
dislocation density by EBSD and ECCI, along
with crystal plasticity FEM simulation
(b)
(a)
(c)
10 µm
Figure 2. (a) Dimensions of tensile test sample (b) Test Figure 3. Speckle patterns generated by electron
specimen underload (c) Illustration of sample morphology beam Pt deposition
4 ECCI (electron channelling contrast imaging)
11
40 µm 500 nm
Figure 6. Backscattered electron image under the best Figure 7. A close up image on the grain under Bragg
set of imaging conditions of the indicated grain condition where dislocation activities are shown
Figure 8. • Electron CHannelling ORientation Determination
Illustration of SEM
stage position: • Imaging and extracting parameters of individual
sample tilted by 8°
and rotated by 1°
rotation step
lattice defect, such as Burgers vector b
• g vector was acquired by EBSD for g · b analysis
0.04 e11
• DIC compares the contrast of speckle
patterns within each subregion in
order to extract force displacement
0 relationship
• Integrated with in-situ tensile test in
the SEM to monitor the evolution of
local deformation under loading steps
-0.04 Figure 10. Stress-strain curve of samples pre and post
heat treatment obtained by ex situ tensile test
of 4 N until ca 5% strain
7 Summary
• In-situ HR-DIC analysis gives evolution of the nominal strain distribution on the
sample surface.
• By HR-EBSD calculations, elastic strain distribution and geometrically necessary
dislocations (GND) density are obtained in the near surface sample interior.
• ECCI can be used to characterise dislocation morphology within corresponding slip
systems, and qualitative analysis on strain field distribution within a certain
interaction volume from sample surface.
Reference:
[1] A. Thomas; M. El-Wahabi; J.M. Cabrera; J.M. Prado (2006). High temperature deformation of Inconel 718. , 177(1-3), 469–472.
doi:10.1016/j.jmatprotec.2006.04.072
[2] High-resolution electron backscatter diffraction: an emerging tool for study local deformation, AJ Wilkinson, EE Clarke, TB Britton, P Littlewood, PS
Karamched, J Strain Analysis for Engineering Design (2010), vol. 45, 365-376