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Dasar Grounding & Bonding
Dasar Grounding & Bonding
and Bonding
Terry Klimchak
Revised 11/19/13
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Copyrighted Materials
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Outline
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Relevant Standards for Utility Grounding
• IEEE Std 80: Guide for Safety in AC Substation Grounding
• IEEE Std 837: Standard for Qualifying Permanent Connections
Used on Substation Grounding
• IEEE Std 142: Grounding of Industrial and Commercial Power
Systems
• IEEE Std 81: Guide for Measuring Earth Resistivity, Ground
Impedance, and Earth Surface Potentials of a
Ground System
• IEEE 1246: Guide for Temporary Protective Grounding
Systems used in Substations
• IEEE 1268: Guide for Safe Installation of Mobile Substation
Equipment
• IEEE C2: National Electrical Safety Code (NESC)
•IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. 6
Purpose of System Grounding
IEEE 142 - 2007
1.3 Purposes of system grounding:
System grounding is the intentional connection to ground of a
phase or neutral conductor for the purpose of:
a) Controlling the voltage with respect to earth, or
ground, within predictable limits, and
b) Providing for a flow of current that will allow
detection of an unwanted connection between system
conductors and ground. Such detection may then initiate
operation of automatic devices to remove the source of
voltage from these conductors.
•IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. 7
Purpose of Grounding
• Limit potential difference of neutral
for system stability
• Allow for operation of relays and system
protections devices
• Personnel safety
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Grounding (IEEE 100)
• Definition:
“A conducting connection, whether intentional or accidental, by which
an electric circuit or equipment is connected to the Earth, or to some
conducting body of relatively large extent that serves in place of the
Earth.”
• Purpose:
Used for establishing and maintaining the potential of the Earth (or
other conducting body) or approximately that potential, on conductors
connected to it, and for conducting ground current to and from the
Earth (or other conducting body).
•IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. 9
Bonding (IEEE 100)
• Definition:
“The permanent joining of metallic parts to form an
electrically conductive path that ensures electrical
continuity and the capacity to conduct safely any current
likely to be imposed.”
• Conclusion:
A Grounding System Is Made up of Both Grounding and
Bonding Elements.
•IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. 10
First: Some Basic Electrical Theory
RA
l A R
m 2
m l
m
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Volume Resistivity of Materials
All in m
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Soil Resistivity
Loam 1 to 50 ohm-m
Clay 20 to 100 ohm-m
Sand & Gravel 50 to 1000 ohm-m
Surface Limestone 100 to 10,000 ohm-m
Shale 5 to 100 ohm-m
Sandstone 20 to 2000 ohm-m
Granites, Basalt 10,000 ohm-m
Slates 10 to 100 ohm-m
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Impedance
Impedance is the sum (and much more complex mathematical operations)
of a circuit resistance elements and the REACTANCE which is caused by
inductors and capacitive elements in the circuit. IT IS AFFECTED BY
FREQUENCY f in Hz. Transients or faults in electrical systems look like very
high frequency events, not 60 hz.
X L L
Inductive Reactance
2f
1
XC
Capacitive Reactance C
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Electrical Systems – Transients
• CLOSED ELECTRICAL SYSTEM:
• Generators, Transformers, and Utilization devices
• Use the earth as a reference for system stability
• The EARTH IS NOT a destination of currents
• The System Neutral is the destination for currents
• Earth is sometimes a conductor during transients
SUBSTATION
500 kV
1,000 MW 30 kV XFMR 15-25 kV
XFMR 500 kV
25 kV XFMR
480V 3Φ
DISTRIBUTION
15-25 kV
25 kV XFMR 17
240/120V 1Φ
Typical Utility System
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Utility Grounding Summary
• Establish Reference to Earth
– Allows for Protection devices to operate
– Keeps metallic and structures at the potential of the earth
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Purpose of Grounding
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AC Three Phase
3 PHASE VOLTAGE
1.5
0.5
Phase A
0 Phase B
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 Phase C
-0.5
-1
-1.5
Angle (/10)
Ground System
Reference
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Utility Substation Grounding
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Typical Substation Grounding
• 4/0 Cu buried at 18”
• 10-20’ grid, welded Typ
• Ground Rods every 20’
typical.
• Extremely low R
• Meets the requirements of
IEEE Standard 80
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Exothermic Welding for Connections
• Provides a Molecular Bond Between
Conductors
– Current Carrying Capacity Equal to that
of the Conductor
– Permanent - Cannot Loosen or Corrode
to Cause a High-Resistance Connection
– Requires No External Source of Power
or Heat
– Can be Visually Checked for Quality
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C & I Grounding
• Generally C & I and Residential grounding methods
establish a good earth reference
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NEC 250 Definition of Grounding
• Intentional permanent low impedance
path to carry fault current
• Capacity to carry ground fault current
• Returns fault current to source, not earth
• Is connected to earth for system reference
• Used to allow operation of protection devices
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C & I and Residential System
Grounding Elements
• Grounded Conductor - Neutral
• Grounded Electrode – Several
• Grounding Electrode Conductor (GEC)
• Service Bonding Jumper
• Equipment Grounding Conductor
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Solidly Grounded 3 Phase Electrical System
Other Grounding
Electrodes
& Bonds 28
NEW – MUST Be
Bonded into GEC
System
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Grounding Electrode Sizing
• Most Grounding
Electrode Conductors
are sized to 250.66 as
they exist downstream
of the service
disconnection device.
Neutral – Grounded
Conductor
Equipment Grounding
Conductors
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Difference between Neutral (Grounded)
and Grounding Conductor
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NEC 250 Resistance Requirement
• Section 250.53 requires < 25 Ω resistance for pipe, rod or
plate electrodes OR
• Add another electrode > 6’ away from the first, WITHOUT
FURTHER MEASUREMENT
Using this formula for resistance (from MIL Handbook 419)
RO Resistance of rod
4l
RO ln d Rod diameter
2l d l rod length
Soil Volume Resistivity
A ¾” by 10’ in 500 Ω M soil would have a resistance of over 160 Ω
Source : http://www.mikeholt.com/newsletters.php?action=display&letterID=407 33
Practical Ground Resistance
• Most rods have much less than 160 Ω
• Typical rod resistances will be less than 25 Ω in most soils
because of the existence of proximate utility ground
references.
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Beware of False Claims
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Other Grounding and Bonding
Applications
• Signal Reference Grids
• Grounding Bus Bars
• Equipotential Mesh
• Rebar Clamps
• Swimming Pool Grounding
• Wind Turbine Grounding
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SRG for Low Impedance Ground
• Stops noise from interfering with
low voltage digital signals.
• Provides a lower impedance ground
reference than signal conductors
and shields.
• Minimizes voltage potential
difference between interconnected
equipment.
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SRG Impedance vs. Freq
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Signal Reference Grids &
Sensitive Electronics Grounding
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Prefabricated Wire Mesh
• Applications:
– Reduce step & touch potential
– Signal Reference Grid
– Antenna ground screen
– Electronic shielding
• Configuration:
– Wire: #6 to #12 - 30 %CW, 40% CW, Cu
– Mesh size: 2” x 2” up to 48” x 24”
– 20’ maximum width - 500 lb maximum weight
– Wire overhang for field splicing using PG style connection.
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EIA/TIA Ground Bars and Ground Plates
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TGB and TMGB Grounding Bus Bars
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Main Elements of Telecom
Grounding and Bonding Equipment
• Bonding Conductor for Telecommunications
• Telecom Main Grounding Busbar (TMGB)
-----------------------------------------------------
• Telecomm Bonding Backbone (TBB)
• Telecomm Grounding Busbar (TGB)
• Telecomm Bonding Backbone Interconnecting
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Bonding Conductor for
Telecommunications
Service
Equipment
TBB
N
Equipment
G TMGB
Bonding
conductor for
Grounding telecommunications
Electrode
Outside the scope of this Standard
Conductor
Within the scope of this Standard
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Grounding and Bonding Summary
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