DESIGN COMPLIANCE

WITH EMI/EMC
GROUP 1
Designing a Printed circuit board (Pcb) With compliance to
electromagnetic interference (EMI) and electromagnetic
compatability (emc) standards is crucial for ensuring that
electronic devices meet regulatory requirements and operate
without causing or being affected by interference. Here are some
key considerations to achieve emi/emc compliance in pcb design:
 GROUNDING

IMPLEMENT A SOLID AND WELL-DEFINED

GROUNDING SCHEME. ENSURE IMPEDANCE
PATHS FOR GROUND CURRENTS, MINIMIZE
GROUND LOOPS, AND SEPARATE ANALOG AND
DIGITAL GROUNDS WHEN NECESSARY.
 DECOUPLING CAPACITORS

PLACE DECOUPLING CAPACITORS

STRATEGICALLY NEAR POWER SUPPLY PINS
OF INTEGRATED CIRCUITS TO SUPPRESS
HIGH-FREQUENCY NOISE AND PROVIDE A
STABLE POWER SUPPLY
 TRACE ROUTING

PAY ATTENTION TO SIGNAL TRACE ROUTING,

ESPECIALLY HIGH-SPEED OR HIGH-FREQUENCY
SIGNALS. USE CONTROLLED IMPEDANCE TRACES
FOR SIGNAL INTEGRITY AND CONSIDER
DIFFERENTIAL PAIR ROUTING FOR REDUCING
COMMON-MADE NOISE.
 EMI FILTERS

INTEGRATE EMI FILTERS AT INPUT/OUTPUT

PORTS TO ATTENUATE CONDUCTED AND
RADIATED NOISE. COMMON-MODE CHOKES
CAN BE EFFECTIVE FOR SUPPRESSING
COMMON-MODE CURRENTS.
 SHIELDING

EMPLOY SHIELDING TECHNIQUES FOR

SENSITIVE COMPONENTS OR SECTIONS OF THE
CIRCUIT. SHIELD TRACES OR COMPONENTS
PRONE TO EMITTING OR RECEIVING
ELECTROMAGNETIC RADIATION.
 COMPONENT PLACEMENT

CAREFULLY PLACE COMPONENTS TO MINIMIZE

LOOP AREAS, ESPECIALLY FOR HIGH-FREQUENCY
COMPONENTS. GROUP COMPONENTS BASED ON
THEIR FUNCTIONS AND CONSIDER THEIR
POTENTIAL IMPACT ON EMI.
 PCB LAYER STACKUP

CHOOSE A LAYER STACKUP THAT MINIMIZES

SIGNAL CROSSTALK AND PROVIDES
CONTROLLED IMPEDANCE FOR HIGH-SPEED
SIGNALS. CONSIDER USING A GROUND PLANE
FOR BETTER SIGNAL INTEGRITY AND EMI
CONTROL.
THANKS FOR
LISTENING!