PHYSICAL VAPOUR

DEPOSITION
Introduction to Physical Vapour Deposition (PVD)

• Definition: Physical Vapour Deposition (PVD) is a vacuum

deposition method used to produce thin films and coatings.
• Applications: Widely used in the semiconductor industry, for
coating tools, decorative finishes, and optical devices.
• Types of PVD: Common methods include evaporation,
sputtering, and arc vapor deposition.
 PVD Process Overview
• Vacuum Chamber: PVD is performed in a vacuum
environment to ensure purity and adherence of the
coating.
• Material Vaporization: The material to be deposited is
vaporized by physical means, such as heating or
bombardment with ions.
• Transport: The vaporized material is transported through
the vacuum to the substrate.
• Deposition: The vapor condenses on the substrate,
forming a thin film or coating.
 Advantages and Applications of PVD
• Advantages: High purity and quality of coatings . Strong adhesion and uniform
thickness . Environmentally friendly compared to chemical methods
• Applications:
• Semiconductors: Manufacturing of integrated circuits and
• microelectronics . Tools: Coating cutting tools to enhance durability and
performance.
• Optics: Producing anti-reflective coatings and mirrors . Decorative Finishes:
Applying wear-resistant and aesthetically pleasing coatings on jewelry and watches.