FACULTY

DEVELOPMENT
PROGRAMME

PCB DESIGN
Day-1
 Orientation, Introduction
to PCB Design
 J.Balraj
Sr. Hardware Engineer
 Orientation about PCB Design
 Day2: Orcad Schematic Diagram – Adding Symbol, creating new symbol
and converting circuit Diagram to Schematic Diagram.
 Day3 : PCB Editor Layout- Footprint Creation, Netlist Creation, Single
Layer PCB, Component Placement.
 Day4 : Single Layer PCB – Artwork Layer, Routing Traces, Layer filling,
Drill Chart, Gerber file creation and viewing.
 Day5 : Double Layer PCB – Footprint adding, Netlist Creation, Component
Placement, Artwork Layer, Routing Traces, Layer filling, Drill Chart, Gerber
file creation and viewing.
 Day6 : PCB Fabrication – Gerber layer printing, Etching Layers, Drilling,
Solder masking, Silkscreen, Profiling and verifying.
 Master in PCB Design
Fabrication of PCB 6

5 Double Layer PCB

Layout with Gerber
Single Layer PCB 4
Layout with Gerber
Single Layer PCB
3 Design
PCB Footprint 2
Schematic
1 Diagram
 Brief about PCB Design
PCB – Printed Circuit Board
PCB is the main key for all the emerging Electronic Smart world.
PCB acts as a bridge between the various components with the help
of tracks, pads and lines incorporated in a laminated copper sheet.
PCB`s are classified majorly by its layers Single, Double and
Multiple.
PCB reduces Time, working Space, Error and cost of the product.
 PCB Evolution
1925: Charless Ducas, an American inventor, he stencils conductive
materials onto a flat wooden board.
1936: Paul Eisler develops the first printed circuit board to use in a radio set.
1943: Eisler patents a more advanced PCB design, glass-reinforced, non-
conductive substrate.
1948: The United States Army releases PCB technology to the public,
prompting widespread development.
2000s: PCBs have become smaller, lighter, much higher layer counts and
more complex.
 Types of Boards
Bread Board

General Purpose Board

Printed Circuit Board

 Types of PCB`s
Single-Layer PCB
Double-Layer PCB
Multilayer PCB
Rigid PCB
Flex PCB
Rigid-Flex PCB
 Layers or Material in PCB`s
Substrate material – FR4, CEM-1 to 3, Polyimide and Metal core.
Core – Rigid base material laminated with Copper on one or two sides.
Prepreg – Dielectric material Sandwiched between two cores.
Copper foil – defined in ounces per square foot.
Solder Mask – acts as insulation on the Copper layer.
Silkscreen – layer allows the user to use symbols, text, numbers, etc.,
 Single Layer PCB
Single Layer PCB consist of one copper Layer, one Solder
mask and one substrate material.
Single Layer PCB is a first choice for beginners.
Simple Diagram of Single Layer PCB.
Soldermask
Copper Layer

Substrate
Silkscreen
 Double Layer PCB
Double Layer PCB consist of two copper Layer(Top &
Bottom), two Solder mask(Top & Bottom) and one substrate
material.
Silkscreen

Soldermask Copper Layer

Substrate
 Multi-Layer PCB
Multi-Layer PCB consist of more than two copper Layer, two
Solder mask(Top & Bottom) and more than two substrate
material.
All the layers can be interconnected with copper-plated holes.
 Rigid PCB
Rigid PCBs are made of solid substrate material that prevents
the board from twisting.
Rigid PCB has single layer, double layer and multilayer
configuration.
 Flex PCB
Flex PCBs are made of Flexible material such as plastic,
polimide or a similar polymer.
Flex PCB has single layer, double layer and multilayer
configuration.
 Rigid-Flex PCB
Rigid-Flex PCB is a combination of flexible PCB and Rigid
PCB.
Both Rigid and Flexible substrate are laminated to form a
single circuit.
 Comparison of PCB
Single Layer PCB Double Layer PCB

vTOP vTOP

vBOTTOM
vBOTTOM
 PCB Characteristics
Through Hole Technology
• In earlier days PCB`s were made using through hole technology.
• Electronics components with leads are inserted in the board holes and soldered on other side of
the board.
• Through hole components has two leads minimum.

Resistor

Transistor
IC Base
 PCB Characteristics
Surface Mount Technology (SMD)
• It came into process in 1960s and commonly used after 1990s.
• Instead of wire leads components came with small ended caps to solder in to PCB Surfaces.
• With this emerging technology pcb size, production time and price reduced.
• All smart technology use this type of components.

Transistor
Resistor

14 Pin IC
 IC SMD Packages
SOIC - Small Outline Integrated Circuit.
SOP - Small Outline Package.
TSOP - Thin Small Outline Package
SSOP - Shrink Small Outline Package
TSSOP - Thin Shrink Small Outline Package
QSOP - Quarter-size Small Outline Package
VSOP - Very Small Outline Package
QFP- Quad flat pack
LQFP - Low profile Quad Flat Pack
PQFP - Plastic Quad Flat Pack
CQFP - Ceramic Quad Flat Pack
TQFP - Thin Quad Flat Pack
PLCC - Plastic Leaded Chip Carrier
BGA - Ball Grid Array
 Thinks to know
Tested Circuit Diagram
Choosing components package such as Through hole or SMD
package
Every components Datasheet with pin details and dimension
Choosing appropriate type of PCB, either single layer, double layer,
multilayer etc.,
Current rating going to be handled by PCB
Pre prediction of components placement
Prediction of size and structure of PCB
 PCB Design General Steps
Verified Tested Circuit Diagram.
PC with Cadence 17.2 Software.
• Capture CIS
• PCB Editor

Cadence Software cracked link

• https://getintopc.com/softwares/3d-designing/cadence-allegro-orcad-17-20-037-free-download-162258
4/

Cadence software installation video

• https://www.youtube.com/watch?v=M3nTag2HVXM

Gerber Viewer (Viewmate)

 PCB Design General Steps
Capture CIS
• Schematic diagram as per circuit diagram.
• Symbol creation for new components.
• Verification of symbol Pin numbers as in Component datasheet.
• Annotate the references numbers
• Error checking or design rule checking
• BOM (Bill of materials) creation for schematic

PCB Footprint Creation

• Identifying existing Footprint and Creating new Footprint if necessary
• Adding footprint to the schematic parts
• Design rule checking
• Netlist Creation
 PCB Design General Steps
PCB Editor
• PCB size fixing
• Importing Netlist
• Placement of components
• Predetermining Gerber layers
• Aligning components
• Routing the track between components
• Refdes alignment
• Pad and drill size verification
• Drill chart customization and generation
• Checking all layers
• Drill file creation
• Gerber file creation for all layers
• Gerber file viewing
 PCB
SCHEMATI
C
Schematic Software Image
Manual Wired Circuit Images
Schematic Diagram
 Symbol
Footprints
Symbol Footprint
 PCB
LAYOUT
PCB Editor Software Image
Unrouted PCB Design
Routed PCB Design
 PCB
Manufacturing
>>Single Layer
 PCB Manufacturing Process
Imaging the Gerber layers
Printing Layers on copper
Etching layer
Layer alignment
Drilling
Solder masking the layer
Silk screening
Surface finishing
Electrical testing
Final quality checking
Packing and shipping
Silkscreen Layer
Bottom Layer
Solder Mask – BOTTOM Layer
Fab & Drill File
PCB Board Layout
Assembled PCB Board
 PCB
Manufacturing
>>Double Layer
Silkscreen Layer
Top Layer
Bottom Layer
Solder Mask – TOP Layer
Solder Mask – BOTTOM Layer
Fab & Drill File
Assembled PCB Board
 Online PCB Manufacture

www.pcbpower.com
www.pcbway.com
Cadence PCB Design Recorded videos with Document and
files.
https://lms.pantechelearning.com/s/store/courses/description/
PCB-Design-using-Allegro
Thank You