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Ceramics Properties F2010
Ceramics Properties F2010
Ceramics Properties F2010
Material Behavior
EEM3212 – Materials Science
Dr Dayang Siti Hazimmah binti Ali
Taxonomy of Ceramics
Glasses Clay Refractories Abrasives Cements Advanced
products ceramics
-optical -whiteware -bricks for -sandpaper -composites engine
-composite -bricks high T -cutting -structural -rotors
reinforce (furnaces) -polishing -valves
-containers/ Adapted from Fig. 13.1 and discussion in
-bearings
household Section 13.2-6, Callister 7e.
-sensors
• Properties:
-- Tm for glass is moderate, but large for other ceramics.
-- Small toughness, ductility; large moduli & creep resist.
• Applications:
-- High T, wear resistant, novel uses from charge neutrality.
• Fabrication
-- some glasses can be easily formed
-- other ceramics can not be formed or cast.
Ceramic Bonding
• Bonding:
-- Mostly ionic, some covalent.
-- % ionic character increases with difference in
electronegativity (remember!?!).
• Large vs small ionic bond character:
CaF2: large
SiC: small
Adapted from Fig. 2.7, Callister 7e. (Fig. 2.7 is adapted from Linus Pauling, The Nature of the Chemical
Bond, 3rd edition, Copyright 1939 and 1940, 3rd edition. Copyright 1960 by
Cornell University.
Ceramic Crystal Structures
Oxide structures
– oxygen anions much larger than metal cations
– close packed oxygen in a lattice (usually FCC)
– cations in the holes of the oxygen lattice
• The same ideas apply to all “ceramics”
• Principles of Ceramic Architecture:
– Size relationships Cation to Anion
– Electrical Neutrality of the overall structure
– Crystallographic Arrangements
– Stoichiometry Must Match
Silica Glass
9
GLASS VISCOSITY VS T AND IMPURITIES
• Viscosity decreases with T increase
• Impurities lower Tdeform
fus sil
96 yre e
sod ss
ed ica
gla
% x
a-l
P
si l
im
ica
s]
10 14
annealing range
Viscosity [Pa
10 10
10
Important Temperatures
•Melting point = viscosity of 10 Pa.s
•Working point= viscosity of 1000 Pa.s
•Softening point= viscosity of 4x107Pa.s
Temperature above which glass cannot
be handled without altering dimensions)
•Annealing point= viscosity of 1012 Pa.s.
•Strain point = viscosity of 3x1013Pa.s
Fracture occurs before deformation
Mg2SiO4 Ca2MgSi2O7
• (Si2O5)2-
• So need cations to balance =
charge
Layered Silicates
• Kaolinite clay alternates (Si2O5)2- layer with Al2(OH)42+ layer
QD / kT
• Equilibrium concentration of defects ~e
Mechanical Properties
fs
Mechanical Issues:
• Properties are significantly dependent on
processing – and as it relates to the level of
Porosity:
• E = E0(1-1.9P+0.9P2) – P is fraction porosity
fs = 0e-nP -- 0 & n are empirical values
2200 3Al2O3-2SiO2
T(°C)
mullite
2000 Liquid
(L) alumina + L
Adapted from Fig. 12.27,
1800 Callister 7e. (Fig. 12.27
• Die surface:
-- 4 m polycrystalline diamond
particles that are sintered onto a
cemented tungsten carbide Courtesy Martin Deakins, GE
substrate. Superabrasives, Worthington,
OH. Used with permission.
-- polycrystalline diamond helps control
fracture and gives uniform hardness
in all directions.
Application: Cutting Tools
• Tools:
-- for grinding glass, tungsten,
carbide, ceramics
-- for cutting Si wafers
-- for oil drilling
suspended
Parison
Finishing wind up
mold
Adapted from Fig. 13.8, Callister, 7e. (Fig. 13.8 is adapted from C.J. Phillips,
Glass: The Miracle Maker, Pittman Publishing Ltd., London.)
Sheet Glass Forming
• Sheet forming – continuous draw
– originally sheet glass was made by “floating”
glass on a pool of mercury – or tin
(50%) 1. Clay
(25%) 2. Filler – e.g. quartz (finely ground)
(25%) 3. Fluxing agent (Feldspar)
binds it together
weak van
der Waals
• Structure of bonding
4+
Kaolinite Clay: charge Si
3+
Adapted from Fig. 12.14, Callister 7e. neutral Al
-
(Fig. 12.14 is adapted from W.E. Hauth,
"Crystal Chemistry of Ceramics", American
OH
2-
Ceramic Society Bulletin, Vol. 30 (4), 1951, O
p. 140.)
Shear
Drying and Firing
• Drying: layer size and spacing decrease. Adapted from Fig.
13.13, Callister 7e.
(Fig. 13.13 is from
W.D. Kingery,
Introduction to
Ceramics, John
Wiley and Sons,
Inc., 1960.)
70 m
Ceramic Fabrication Methods-IIB
GLASS PARTICULATE CEMENTATION
FORMING FORMING
Sintering: useful for both clay and non-clay compositions.
• Procedure:
-- produce ceramic and/or glass particles by grinding
-- place particles in mold
-- press at elevated T to reduce pore size.
• Aluminum oxide powder:
-- sintered at 1700°C
for 6 minutes.
Adapted from Fig. 13.17, Callister 7e.
(Fig. 13.17 is from W.D. Kingery, H.K.
Bowen, and D.R. Uhlmann, Introduction
to Ceramics, 2nd ed., John Wiley and
Sons, Inc., 1976, p. 483.)
15 m
Powder Pressing
Sintering - powder touches - forms neck &
gradually neck thickens
– add processing aids to help form neck
– little or no plastic deformation
Hot pressing - pressure + heat Adapted from Fig. 13.16, Callister 7e.
Tape Casting
• thin sheets of green ceramic cast as flexible tape
• used for integrated circuits and capacitors
• cast from liquid slip (ceramic + organic solvent)
• Ceramic Armor
– Al2O3, B4C, SiC & TiB2
– Extremely hard materials
• shatter the incoming projectile
• energy absorbent material underneath
Applications: Advanced Ceramics
Electronic Packaging
• Chosen to securely hold microelectronics &
provide heat transfer
• Must match the thermal expansion coefficient of
the microelectronic chip & the electronic packaging
material. Additional requirements include:
– good heat transfer coefficient
– poor electrical conductivity